An improved forming tool for forming at least one lead of a semiconductor package includes a member having at least one surface. The at least one surface of the member has a first shape for forming the at least one lead of the semiconductor package to a shape corresponding to the first shape. The...http://www.google.com/patents/US5826628?utm_source=gb-gplus-sharePatent US5826628 - Form tooling and method of forming semiconductor package leads
