IC-processed microneedles

United States Patent [i9]

Lin et al.

[54] IC-PROCESSED MICRONEEDLES

[75] Inventors: Liwei Lin; Albert P. Pisano, both of Berkeley, Calif.

[73] Assignee: The Regents of the University of
California, Oakland, Calif.

[21] Appl. No.: 254,328
[22] Filed: Jun. 6,1994

[51] Int. CI.6 A61M 5/32

[52] U.S. CI 604/264

[58] Field of Search 604/22, 264, 280,

604/30, 43, 51-53

[56] References Cited

U.S. PATENT DOCUMENTS

4,221,567 9/1980 Clark et al. .

4,461,304 7/1984 Kuperstein .

4,478,222 10/1984 Koning et al. .

4,502,938 3/1985 Covington et al. .

4,874,499 10/1989 Smith et al 204/403

4,902,278 2/1990 Maget et al. .

4,969,468 11/1990 Byers et al. .

5,106,365 4/1992 Hernandez .

5,130,276 7/1992 Adams et al. .

5,285,131 2/1994 Muller et al. .

OTHER PUBLICATIONS

K. Najafi et al., "A High-Yield IC-Compatible Multichannel Recording Array," IEEE Micro Trans, on Electron Devices, vol. ED-32, pp. 1206-1211, Jul. 1985. E. Bassous, "Fabrication of Novel Three-Dimensional Microstructures by the Anisotropic Etching of (100) and (110) Silicon," IEEE Trans, on Electron Devices, vol. Ed-25, No. 10, Oct. 1978.

L. Lin et al., "Bubble Forming on a Micro Line Heater", Proceedings of ASME Winter Annual Meeting, Micromechanical Sensors, Actuators and Systems, DSC-vol. 32, pp. 147-163, 1991.

R. M. Moroney et al., "Microtransport Induced by Ultrasonic Lamb Waves," Applied Physics letters, pp. 774-776, V59, Aug., 1991.

Illlllllllllllllllllllllllllllllllllllllllinillll

US005591139A [li] Patent Number: 5,591,139 [45] Date of Patent: Jan. 7,1997

H. T. G. Van Lintel et al., "A Piezoelectric Micropump Based on Micromachming of Silicon," Sensors and Actuators, vol. 15, pp. 153-157, 1988.

M. Esashi et al., "Normally Closed Microvalve and Micropump Fabricated on a Silicon Wafer," Sensors and Actuators, vol. 20, pp. 163-169, Nov. 1989. S. F. Bart et al., "Microfabricated Electrohydrodynamic Pumps," Sensors and Actuators, vol. 21, Nl-3, pp. 193-197, Feb. 1990.

C. J. Kim et al., "Silicon-Processed Overhanging Micro-
gripper," IEEE/ASME Journal of Microelectromechanical
Systems, vol. 1, pp. 31-36, Mar. 1992.
L. Lin et al., "Microbubble Powered Actuators," IEEE
International Conference on Solid-State Sensors and Actua-
tors, Transducers '91, pp. 1041-1044, San Francisco, Jun.
1991.

L. Lin et al., "Vapor Bubble Formation on a Micro Heater in
Confined and Unconfined Micro Channels," ASME 1993
National Heat Transfer Conference, Atlanta, Aug. 1993.
C. H. Mastrangelo et al., "Electrical and Optical Character-
istics of Vacuum Sealed Polysilicon Microlamps," IEEE
Micro Trans, on Electron Devices, vol. 39, pp. 1363-1375,
Jun., 1992.

L. Lin et al., "Vacuum Encapsulated Lateral Microresonators," Technical Digest, 7th Int. Conf. on Solid-State Sensors and Actuators (270-273), Inst, of Electr. Eng. of Japan, 7-10 Jun. 1993, Yokohama, Japan.

K. Takahashi et al., "Integration of Multi-Microelectrode and Interface Circuits by Silicon Planar and Three-Dimensional Fabrication Technology," Sensors and Actuators, vol. 5, pp. 89-99, 1984.

K. Najafi et al., "Strength Characterization of Silicon Microprobes in Neurophysiological Tissues," IEEE Trans, on Biomedical Engineering, vol. 37, No. 5, pp. 474-481, May, 1990.

Primary Examiner—Manuel Mendez

Attorney, Agent, or Firm—Fish & Richardson PC.

[57] ABSTRACT

An IC-processed microneedle including an interface region and shaft. A shell defines an enclosed channel to form the shaft. The shaft has ports to permit fluid movement therethrough. Microheaters, microdetectors and additional devices may also be fabricated on the microneedle.

26 Claims, 14 Drawing Sheets