United States Patent   Patent Number: 4,706,097
Harmon  Date of Patent: Nov. 10, 1987
 Inventor: John P. Harmon, Vancouver, Wash..
 Assignee: Hewlett Packard Company, Palo Alto, Calif.
 Appl. No.: 848,366
 Filed: Apr. 3,1986
 IntCl.* G01D 15/24
 U.S. CI 346/139 C; 346/140 R;
 Field of Search 346/1.1, 140, 139 C;
339/95 R, 75 M, 61 M, 17 F, 176 MF; 439/492
 References Cited
U.S. PATENT DOCUMENTS 4,116,517 9/1978 Selvin 339/61 M X
Buck, Roy T.; Printhead Interconnect, Hewlett-Packard Journal, vol. 36, No. 5, May 1985, p. 14.
Primary Examiner—Joseph W. Hartary
Attorney, Agent, or Firm—William J. Bethurum
A printhead for a thermal ink jet printer or the like is brought into good electrical contact with raised electrical contacts on a flexible interconnect circuit by the use of a molded near-linear spring connect structure. This novel structure includes a horizontal central locating member from which a plurality of resilient hollow cylinders extend vertically upward and in alignment with the electrical contacts on the flexible interconnect circuit. Since there is a near-linear deflection of the cylinder walls with increasing force applied thereto, good electrical contact is achieved between the printhead and the flex circuit using a minimum of force, thereby minimizing the likelihood of damage to the printhead.
4 Claims, 6 Drawing Figures