Division of application No. 09/138,372, filed on Aug. 21, 1998, now Pat. No. 6,153,929.
(51) Int. CI.7 H01L 21/44; H01L 21/48;
(52) U.S. CI 438/106; 438/109
(58) Field of Search 438/106, 109
* cited by examiner
Primary Examiner—-John F. Niebling
Assistant Examiner—Josetta I. Jones
(74) Attorney, Agent, or Firm—Trask Britt
A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with busses formed on one side. In another embodiment, the connector comprises multiple busses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with busses within the cage, or, alternatively, are directly fixed to leads or pads on the host circuit board.
7 Claims, 9 Drawing Sheets