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US006676760B2
(12) United States Patent ao) Patent No.: us 6,676,760 B2
Kholodenko et al. (45) Date of Patent: Jan. 13,2004
(54) PROCESS CHAMBER HAVING MULTIPLE GAS DISTRIBUTORS AND METHOD
(75) Inventors: Arnold V. Kholodenko, San Francisco, CA (US); Dan Katz, Agoura Hills, CA (US); Wing L. Cheng, Sunnyvale, CA (US)
(73) Assignee: Applied Materials, Inc., Santa Clara, CA (US)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 09/930,938
(22) Filed: Aug. 16, 2001
(65) Prior Publication Data
US 2003/0033979 Al Feb. 20, 2003
(51) Int. CI.7 C23C 16/00; H05H 1/00
(52) U.S. CI 118/728; 118/715; 118/726;
118/723 R; 156/345.33; 156/345.51
(58) Field of Search 118/728, 726,
118/715, 723 I, 723 E, 723 R; 156/345.33, 345.34, 345.51, 345.48, 345.47
(56) References Cited
U.S. PATENT DOCUMENTS
A substrate processing chamber has a substrate support to support a substrate, and an exhaust conduit about the substrate support. A first process gas distributor directs a first process gas, such as a non-reactive gas, about the substrate perimeter and toward the exhaust conduit at a first flow rate to form a curtain of non-reactive gas about the substrate. A second process gas distributor directs a second process gas, such as reactive CVD or etchant gas, toward a central portion of the substrate at a second flow rate which is lower than the first flow rate. A gas energizer energizes the first and second process gases in the chamber. A controller operates the substrate support, gas flow meters, gas energizer, and throttle valve, to process the substrate in the energized gas.
22 Claims, 7 Drawing Sheets
