A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the semiconductor wafer into a plurality...http://www.google.com/patents/US7269897?utm_source=gb-gplus-sharePatent US7269897 - Manufacturing process of a stacked semiconductor device
Manufacturing process of a stacked semiconductor device
