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5,956,134 A 9/1999 Roy et al.
6,047,084 A * 4/2000 Kent et al 382/147
6,522,777 Bl * 2/2003 Paulsen et al 382/154
6,526,165 Bl * 2/2003 Montillo et al 382/145
FOREIGN PATENT DOCUMENTS WO WO 99/00661 1/1999
Donald J. Svetkoff et al. "Automatic Inspection of Component Boards using 3D and Greyscale Vision", Proceedings of ISHM, pp. 58-64, Nov. 1986 *
Primary Examiner—Samir Ahmed
(74) Attorney, Agent, or Firm—Brooks Kushman PC.
A method and system are provided for inspecting electronic components mounted on printed circuit boards utilizing both 3-D and 2-D data associated with the components and the background on which they are mounted on the printed circuit board. Preferably, a 3-D scanner in the form of a solid state dual detector laser images the components and solder paste on the printed circuit board to obtain the 3-D and 2-D data. Then, a high speed image processor processes the 3-D data to find the locations of the leads and the solder paste. Then, the high speed image processor processes the 2-D data together with the locations of the leads and the solder paste to distinguish the leads from the solder paste. The high speed image processor may calculate centroids of feet of the leads, average height of the feet and border violation percentage of the solder paste.
23 Claims, 9 Drawing Sheets
P. Mengel, Automated Inspection of Solder Joints On PC Boards By
Supplementary Processing of 3D And Gray-Level Images, IEEE
Industrial Electronics Society, vol. I, Nov. 27, 1990.
P. Mengel, Flachbaugruppen Optisch Und Physikalisch Prufen,
Feinwerktechnik & Messtechnik, No. 12, Dec. 1990.
Svefkoff, Donald, et al., Automated Inspection of Component
Boards Using 3D and Greyscale Vision, Nov. 1986, Proceedings of
Svefkoff, Donald, et al., A High Speed, 3-D Imager For Inspection and Measurement of Minature Industrial Parts, 1989, SME Conference on Machine Vision.
Juha, Michael, et al., Lhe Use of 3-D Imaging For Lhe Inspection of Hybrid/SML Circuits, Nov. 1986, Proceedings of ISHM.