Integrated circuit cooling and insulating device and method

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US007304380B2

(12) United States Patent

Farrar et al.

(io) Patent No.: (45) Date of Patent:

US 7,304,380 B2 Dec. 4, 2007

(54) INTEGRATED CIRCUIT COOLING AND INSULATING DEVICE AND METHOD

(75) Inventors: Paul A. Farrar, Bluffton, SC (US);

Leonard Forbes, Corvallis, OR (US);
Kie Y. Ahn, Chappaqua, NY (US);
Joseph E. Geusic, Berkeley Heights,
NJ (US); Arup Bhattacharyya, Essex
Junction, VT (US); Alan R. Reinberg,
Cheshire, CT (US)

(73) Assignee: Micron Technology, Inc., Boise, ID
(US)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

(21) Appl. No.: 11/482,308

(22) Filed: Jul. 7, 2006

(65) Prior Publication Data

US 2006/0249837 Al Nov. 9, 2006

Related U.S. Application Data

(62) Division of application No. 10/930,252, filed on Aug. 31, 2004.

(51) Int. CI.

H01L 23/34 (2006.01)

(52) U.S. CI 257/715; 257/E23.082;

257/E23.088; 257/E23.098

(58) Field of Classification Search 257/715

See application file for complete search history.

(56) References Cited

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2004/0000150 Al 1/2004 Symko et al.

2005/0285220 Al 12/2005 Farrar

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* cited by examiner