4,871,417 10/1989 Nishizawa et al 134/155 X
4,923,054 5/1990 Ohtani .
4,960,406 10/1990 Gorodissky et al 494/10 X
FOREIGN PATENT DOCUMENTS
54-71991 6/1969 Japan 134/902
1-304732 12/1982 Japan 134/90
Primary Examiner—Frankie L. Stinson
Attorney, Agent, or Firm—Wells, St. John, Roberts,
Gregory & Matkin
A single wafer processing apparatus includes a portable processing head that can be a portable module or a movable unit mounted to a supporting machine frame. The processing head has movable fingers adapted to grip a wafer. The fingers protrude from a protective wafer plate. Indexing and rotation monitoring assemblies are provided for automation of the wafer processing steps. A complementary processing base includes an upwardly-open bowl that receives a wafer held by the portable processing head. It has a full-diameter movable bottom wall for rapid draining purposes. Liquid and/or gas jets and nozzles supply fluids required within the bowl for processing of wafers.
12 Claims, 11 Drawing Sheets