United States Patent [19] [ii] Patent Number: 4,543,295
St. Clair et al. [45] Date of Patent: Sep. 24, 1985
[54] HIGH TEMPERATURE POLYIMIDE FILM LAMINATES AND PROCESS FOR PREPARATION THEREOF
[75] Inventors: Anne K. St. Clair; Terry L. St. Clair,
both of Poquoson, Va.
[73] Assignee: National Aeronautics and Space
Administration, Washington, D.C.
[21] Appl. No.: 663,840
[22] Filed: Oct. 24, 1984
Related U.S. Application Data
[63] Continuation-in-part of Ser. No. 189,234, Sep. 22,1980, abandoned.
[51] Int.Cl.4 B32B 15/08
[52] U.S. CI 428/458; 156/307.7;
156/308.2; 156/309.9; 156/331.5; 427/385.5;
427/388.1; 428/473.5
[58] Field of Search 156/331.5, 307.7, 308.2,
156/309.9, 324; 427/135,404,407.1,409, 338.1, 429, 385.5; 428/458, 473.5
[56] References Cited
U.S. PATENT DOCUMENTS
3,179,634 4/1965 Edwards 156/331.5
3,449,193 6/1969 Biatton et al 156/324
3,608,054 9/1971 Alvino et al 427/429
4,065,345 12/1977 Progar et al 156/331.5
4,411,952 10/1983 Sasaki et al 428/332
4,487,911 12/1984 Lange et al 428/458
Primary Examiner—S. L. Childs
Attorney, Agent, or Firm—Wallace J. Nelson; Howard J.
Osborn; John R. Manning
[57] ABSTRACT
High temperature polyimide film laminates and a process for fabricating large-area, void-free polyimide laminate structures wherein multiple-ply polyimide film laminates may be constructed without decreasing the individual film strength and wherein layers of metal foil may be laminated between polyimide film layers to yield a flexible high temperature resistant structure having capabilities for use as flexible electric circuits, in aerospace applications, and the like.
42 Claims, 14 Drawing Figures
