(19) United States
(12) Patent Application Publication (io) Pub. No.: US 2005/0005435 Al
Yanagida (43) Pub. Date: Jan. 13,2005
(54) ELECTRONIC COMPONENT MOUNTING METHOD
(75) Inventor: Tsutomu Yanagida, Gunma (JP)
Correspondence Address:
Barry E. Bretschneider
Morrison & Foerster LLP
Suite 300
1650 Tysons Boulevard
McLean, VA 22102 (US)
(73) Assignee: Hitachi High-Tech Instruments Co., Ltd., Ora-gun (JP)
(21) Appl. No.: 10/850,440
(22) Filed: May 21, 2004
(30) Foreign Application Priority Data
May 23, 2003 (JP) 2003-145834
Publication Classification (51) Int. CI.7 I105K 3/30
The invention provides an electronic component mounting method which improves a work efficiency and enables pickup of electronic components without fail. A component feeding unit mounted with a master tape formed with pickup position indication holes is fixed to an adjusting jig. A recognition camera takes an image of a recognition mark to calculate a center position thereof, moves to a position corresponding to a component pickup position previously stored in a memory portion, and takes an image of the pickup position indication hole provided in the master tape to calculate a component pickup position. Data on a positional relationship between the recognition mark and the pickup position based on a result of this recognition processing are stored in a memory in the component feeding unit. The component feeding units each mounted with a storage tape are fixed to a base of an electronic component mounting apparatus. When an electronic component mounting operation is performed, a board recognition camera takes an image of the recognition mark provided in the component feeding unit to calculate a center position thereof, and the CPU corrects a pickup position of a suction nozzle based on the pickup position data stored in the memory.
