CIRCUIT AND A METHOD FOR
CONFIGURING PAD CONNECTIONS IN AN
 Inventors: Jeffrey P. Wright; Hua Zheng, both of Boise, Id.
 Assignee: Micron Technology, Inc., Boise, Id.
 Appl. No.: 09/115,104  Filed: Jul. 13, 1998
Related U.S. Application Data
 Division of application No. 08/619,261, Mar. 18, 1996, Pat. No. 5,796,266.
 Int. C I. G01R 31/28
 U.S. CI 324/763; 714/733
 Field of Search 324/763, 765,
324/73.1, 158.1; 714/733
 References Cited
U.S. PATENT DOCUMENTS
4,336,495 6/1982 Hapke 324/765
4,339,710 7/1982 Hapke 324/763
Primary Examiner—Ernest Karlsen
Attorney, Agent, or Firm—Dorsey & Whitney LLP
An integrated device includes a configuration circuit that is coupled to first and second bond pads and first and second conductive paths of the integrated device. The circuit receives a map signal that has a first value during a first operational mode of the integrated device and a second value during a second operational mode of the integrated device. In response to the first value, the circuit couples the first pad to the second conductive path. In response to the second value, the circuit couples the first pad to the first conductive path and the second pad to the second conductive path. The first operational mode may be a wafer test mode.
13 Claims, 3 Drawing Sheets