Hermetic package for multiple contact-sensitive electronic devices and ...

(54) HERMETIC PACKAGE FOR MULTIPLE
CONTACT-SENSITIVE ELECTRONIC
DEVICES AND METHODS OF
MANUFACTURING THEREOF

(75) Inventors: Martin P. Goetz, Dallas, TX (US);

Merrill A. Hatcher, Garland, TX (US);
Christopher E. Jones, Arlington, TX
(US)

(73) Assignee: Clarisay, Inc., Dallas, TX (US)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

(21) Appl. No.: 09/998,368

(22) Filed: Nov. 29, 2001

(51) Int. CI.7 H01L 21/44

(52) U.S. CI 438/110; 438/113; 438/127

(58) Field of Search 438/106, 107,

438/108, 113, 110, 112, 114, 127; 257/678, 723, 778, 787; 174/52.2, 52.3

(56) References Cited

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OTHER PUBLICATIONS

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* cited by examiner

A method of manufacturing a hermetic package. In one embodiment, the method includes: (1) forming a plurality of contact-sensitive electronic devices on a device substrate, each of the plurality of devices having an active surface, (2) providing a mounting substrate, (3) forming a grid of dam material between the device substrate and the mounting substrate that is pitched as a function of lateral dimensions of the plurality of devices, (4) bringing the device substrate and the mounting substrate together until the active surface of each of the plurality of devices is proximate, but spaced apart from, the mounting substrate, the mounting substrate and the dam material cooperating to form packages for the plurality of devices and (5) dicing the device substrate to separate the packages.

18 Claims, 3 Drawing Sheets