"Microelectronic Packaging", IBM Tech. Disc. Bull., vol. 12, #5, Oct. '69, p. 727.
"Integrated Cooling for High-Density Electronic Components", IBM Tech. Disc. Bull, vol. 14, #8, Jan. '72, p. 2532.
"Substrate Mounted Heat Pipe for Chip Cooling", IBm Tech. Disc. Bull., vol. 14, #9, Feb. '72, p. 2690.
Primary Examiner—Peter A. Nelson
Attorney, Agent, or Firm—Morgan, Finnegan, Pine,
Foley & Lee
An array of laser generating elements is mounted upon at least one substrate in a one-dimensional band, with essentially one laser emitting surface facing two lens assemblies, the first being an array of piano-cylindrical inner lenses, equal in number to the number of bands of laser elements with their focal axes parallel to such bands, and the second being a single piano-cylindrical outer lens having its focal axis perpendicular to those of the lenslets. Advantageously, the substrates are assembled such that each laser element is in essentially precise alignment with its corresponding lenslet for its preselected operating temperature. Also advantageously, the curved surfaces of each inner lens and of the outer lens are formed to a slightly acylindrical shape for essentially complete collimation of the laser radiation. Further advantageously, a heat removal system may be incorporated in the mounting substrate which is formed with an expanded rear face, having a coolant applied thereto. Moreover, an optical integrator may also be positioned between the laser emitting surface and the array of lenslets for generating a wider far field angle.
38 Claims, 13 Drawing Figures