Integrated circuit package

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

US007619303B2

(12) United States Patent

Bayan

(io) Patent No.: (45) Date of Patent:

US 7,619,303 B2 Nov. 17, 2009

(54) INTEGRATED CIRCUIT PACKAGE

(75) Inventor: Jaime A. Bayan, Palo Alto, CA (US)

(73) Assignee: National Semiconductor Corporation,

Santa Clara, CA (US)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 77 days.

(21) Appl.No.: 11/961,798

(22) Filed: Dec. 20, 2007

(65) Prior Publication Data

US 2009/0160067 Al Jun. 25, 2009

(51) Int. CI.

H01L 23/495 (2006.01)

H01L 23/02 (2006.01)

H01L 23/34 (2006.01)

H01L 23/52 (2006.01)

H01L 23/48 (2006.01)

H01L 23/40 (2006.01)

(52) U.S. CI 257/666; 257/673; 257/678;

257/723; 257/777; 257/E23.039; 257/E23.043;

257/E23.045

(58) Field of Classification Search 257/666,

257/673, 678, 723, 777, E23.039, E23.043,

257/E23.045 See application file for complete search history.

(56) References Cited

U.S. PATENT DOCUMENTS

5,596,225 A 1/1997 Mathew et al.

5,677,567 A * 10/1997 Maetal 257/666

6,080,264 A * 6/2000 Ball 156/292

6,184,573 Bl * 2/2001 Pu 257/666

6,204,554 Bl 3/2001 Ewer et al.

6,353,257 Bl 3/2002 Huang

6,388,336 Bl * 5/2002 Venkateshwaran et al. .. 257/779

6,424,024 Bl 7/2002 Shih et al.

An integrated circuit package is described that includes two dice. The active surface of each die includes a plurality of I/O pads. The active surface of the first die is positioned adjacent first surfaces of the leads of a lead frame such that I/O pads from the first die are arranged adjacent corresponding solder pad surfaces on the first surfaces. Similarly, the active surface of the second die is positioned adjacent second surfaces of the leads opposite the first surfaces such that I/O pads from the second die are arranged adjacent corresponding solder pad surfaces on the second surfaces. A plurality of solder joints are arranged to physically and electrically connect I/O pads from the first or second die to associated adjacent solder pad surfaces on the leads. In this way, a single lead frame can be utilized to package two dice, one on either side of the leads of the leadframe.

24 Claims, 9 Drawing Sheets