(54) APPARATUS, SYSTEM, AND METHOD FOR THERMAL CONDUCTION INTERFACING
(75) Inventors: Timothy S. Farrow, Cary, NC (US);
Dean F. Herring, Youngsville, NC (US)
(73) Assignee: International Business Machines Corporation, Armonk, NY (US)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
This patent is subject to a terminal disclaimer.
(21) Appl.No.: 12/186,363
(22) Filed: Aug. 5, 2008
(65) Prior Publication Data
US 2008/0285235 Al Nov. 20, 2008
Related U.S. Application Data
(62) Division of application No. 11/343,673, filed on Jan. 31, 2006.
(51) Int. CI.
H0SK 7/20 (2006.01)
H01L 23/467 (2006.01)
(52) U.S. CI 361/704; 361/705; 361/709;
361/679.54; 165/80.2; 165/80.3; 165/104.15;
165/104.16; 508/161; 508/172
(58) Field of Classification Search 361/702 712,
361/715-724; 257/706-727; 174/15.1, 16.3, 174/252; 165/46, 80.3, 80.4, 104.33, 185, 165/186, 104.19; 508/161, 172 See application file for complete search history.
(56) References Cited
U.S. PATENT DOCUMENTS
An apparatus, system, and method are disclosed for thermal conduction interfacing. The system for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The system includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the system includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such a system would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the system would be modular, reusable, and easy to install or replace without a significant mess.
20 Claims, 6 Drawing Sheets