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United States Patent

US007888843B2

(12) (10) Patent No.: US 7,888,843 B2 Ayazi et al. (45) Date of Patent: Feb. 15, 2011 (54) THIN-FILM 6,739,190 B2 5/2004 Hsu et al. PIEZOELECTRIC-ON-INSULATOR 7,199,504 B2 4/2007 Komuro et al. fig:g§i¥g§ig‘i\)‘gg(%€I1g?§ATED 7,202,761 B2 4/2007 Lutz et al. 7,280,007 B2 10/2007 Feng et al. (75) Inventors: Farrokh Ayazi, Atlanta, GA (U S); Logan D. Sorenson, Atlanta, GA (US) (73) Assignee: Georgia Tech Research Corporation, (Continued) Atlanta GA (US) FOREIGN PATENT DOCUMENTS ( * ) Notice: Subject to any disclaimer, the term of tl1is Ep 1 217 73 5 A1 6/2002 patent is extended or adjusted under 35 U.S.C. l54(b) by 0 days. (21) Appl. No.: 12/535,284 (Continued) (22) Filed: Aug. 4, 2009 OTHER PUBLICATIONS (65) Pfigf Publicatign Data Baborowski et al., “Piezoelectrically Activated Silicon Resonators”, IEEEF C tr lS ' ,2007J ' t 'thth 2ls’E Us A1 pean 4:33:32; ,3; ;1m:t§::;::,mM,y 1, XP03ll38l58, t' I. Related U.S. Application Data Sec Ion (63) Continuation-in-part of application No. 12/233,395, (Continued) filed on Sep. 18, 2008, now Pat. No. 7,800,282. Primary Examl~ne,,_Mark Budd (60) Provisional application No. 61/095,776, filed on Sep. (74) Anome)/I A891", 0?Fl7m*MYer5 Bigel Sibley & 10, 2008. Saiovec (51) Int. Cl. (57) ABSTRACT H01L 41/08 (2006.01) (52) U.S. Cl. ...................... .. 310/324; 310/312; 310/320 (58) Field of Classification Search ............... .. 310/312, A micro-electromechanical resonator self-compensates for 310/320 process-induced dimensional variations by using a resonator See appljcafign file fQ1' Qgmplete Search hj5tQ1'y_ body having a plurality of perforations therein. These perfo56 R f C_ d rations may be spaced along a longitudinal axis of the reso( ) e erences lte nator body, which extends orthogonal to a nodal line of the

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Casinovi et al., “Analytical Modeling and Numerical Simulation of Capacitive Silicon Bulk Acoustic Resonators,” IEEE International Conference on Micro Electro Mechanical Systems, Jan. 2009, pp. 935-938.

Kim et al., “Temperature Dependence of Quality Factor in MEMS Resonators,” Journal of Microelectromechanical Systems, vol. 17, No. 3, Jun. 2008, pp. 755-766.

Kim et al., “Micromechanical Resonant Displacement Gain Stages,”IEEE, 2009, pp. 19-22.

Pourkamali et al., “Low-impedance VHF and UHF Capacitive Silicon Bulk Acoustic Wave Resonators—Part I: Concept and Fabrication,” IEEE Transaction On Electron Devices, vol. 54, No. 8, Aug. 2007, pp. 2017-2023.

Schoen et al., “Temperature Compensation in Silicon-Based MicroElectromechanical Resonators”, IEEE Conference on Micro Electromechanical Systems 2009, Jan. 25, 2009, pp. 884-887, XP031444436, figures 1-3.

“Film Bulk Acoustic-Wave Resonator (FBAR),” Admitted Prior Art, http://mems.usc .edu/fbar.htm, Printed from the Internet Jan. 6, 2009, 3 pages.

“Finite element method,” Admitted Prior Art, http://enwikipedia. org/wiki/Finite_element_method, Printed from the Internet Oct. 28, 2008, 7 pages.

Abdolvand et al., “A Low Voltage Temperature-Stable Micromechanical Piezoelectric Oscillator,” Digest of the 14th International Conference on Solid State Sensors, Actuators and Microsystems (Transducers ’07), Lyon, France, Jun. 2007, pp. 53-56. Abdolvand et al., “A Temperature-Compensated ZnO-on-Diamond Resonant Mass Sensor,” Proc. 5th IEEE Conference on Sensors, 2006, pp. 1297-1300.

Abdolvand et al., “Single-Resonator Dual-Frequency Thin-Film Piezoelectric-on-Substrate Oscillator”, IEEE International Electron Devices Meeting, 2007, pp. 419-422.

Dubois, Marc-Alexandre., “Thin film bulk acoustic wave resonators: a technology overview,” MEMSWAVE 03, Toulouse, France, Jul. 2-4, 2003.

Ho et al., “High Order Composite Bulk Acoustic Resonators,” Proc. 20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS ’07), Kobe, Japan, Jan. 2007, pp. 791-794.

Ho et al., “Temperature Compensated IBAR Reference Oscillators,” Proc. 19th IEEE International Conference on Micro Electro Mechanical System,(MEMS ’06), Istanbul, Turkey, Jan. 2006, pp. 910-913.

Jaakkola et al., “Piezoelectrically transduced Single-Crystal-Silicon Plate Resonators,” VTT Technical Research Centre of Finland, Finland.

Nam et al., “Piezoelectric Properties of Aluminum Nitride for Thin Film Bulk Acoustic Wave Resonator,” J . Korean Physical Society, 47:S309-S312 (2005).

Lin et al., “Series-Resonant VHF Micromechanical Resonator Reference Oscillators,”IEEE Journal ofSolid-State Circuits, vol. 39, No. 12, Dec. 2004, pp. 2477-2491.

Luoto et al., “MEMS on cavity-SOI wafers,” Solid State Electronics 511328-332 (2007).

Schodowski, “Resonator Self-Temperature-Sensing Using A DualHarmonic-Mode Crystal Oscillator,” Proc. of the 43rd Annual Symposium on Frequency Control, Jun. 1989, pp. 2-7.

Sundaresan et al., “A Low Phase Noise 100MHz Silicon BAW Reference Oscillator,” Proc. IEEE Custom Integrated Circuits Conference, Sep. 2006, pp. 841-844.

Vig, “Dual-mode Oscillators for Clocks and Sensors,” Procs. IEEE Ultrasonics Symposium, vol. 2, No. 1999, pp. 859-868.

* cited by examiner

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