(12) United States Patent ao) Patent No.: us 6,709,218 Bi
Freerks et al. (45) Date of Patent: Mar. 23,2004
FOREIGN PATENT DOCUMENTS
EP 0423608 Al 4/1991
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EP 0 445 651 A2 9/1991 H01L/21/00
EP 0777264 Al 6/1997
EP 0 793 262 A2 9/1997 H01L/21/00
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U.S. Patent Application Entitled: "Mechanical Gripper for Wafter Handling Robots," Ser. No. 09/283,995; Filing Date Apr. 1, 1999; Inventors: Satish Sundar, et al.
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Japan Abstract 2-80566.
Sundar, Satish, "Improved Throughput Using Time-Optimal Motion Planning and Design".
The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.
23 Claims, 8 Drawing Sheets