A substrate, an alignment plate, a heat sink, a back plate, a plurality of spacers, and a plurality of nuts are used to removably package one or more semiconductor package into a single module. The semiconductor dies are packaged with tape automated bonding (TAB) packages having land grid array (LGA)...http://www.google.com/patents/US5648893?utm_source=gb-gplus-sharePatent US5648893 - Upgradable multi-chip module
