couple signals to one or more optoelectronic compo
ARRANGEMENT FOR INTERCONNECTING AN nents mounted on the substrate.
OPTICAL FIBER AN OPTOELECTRONIC According to another embodiment, a connector ap
COMPONENT paratus includes a substrate having a plurality of electri
5 cal paths onto which is mounted at least one flip-chip
RELATED APPLICATION type optoelectronic component. The substrate includes
„ . , , . ^ ^ . ,. , , . . „ . a hole formed between a second surface and a first Related subject matter ,s disclosed m the following ... Qf ^ sub ^ ... ... ^
application filed concurrently herewith and assigned to ^ tical fiber ^ 0 toelectronicf component £_
the ^it^f f, ... ... ap.p TMn Ser: 10 eludes is ahgned over the hole to couple optical signals
No. 08/088,684, filed Jul. 6, 1993 and entitled "Optical t0 and fronfthe optical fiber mounted through the hole
Fiber Connective Device and Its Method of Assem- in the substrate. Qne or more electrical contacts con
bly," inventors Theodore Sizer, II and James Albert nected t0 one or more electrical paths of the substrate,
Walker. are used for communicating electrical signals to and
TECHNICAL FIELD ^ from the optoelectronic component. According to one
connector, the one or more electrical contacts are The present invention relates to optical fiber connec- mounted in line with the optical fiber and arranged, tion arrangements and, more particularly, to a method respectively, to make connection with one or more and apparatus for interconnecting optical fiber and an contacts on the edge of a printed circuit board. Accordoptoelectronic component. 20 ing to yet another connector embodiment, one or more
... r\T7 Tuc Txn 7CMTTAM electrical contacts are aligned with the substrate and
BACKGROUND OF THE INVENTION „ ,t .. , J? . , ^ it_ , ^ ^
orthogonal to the optical fiber mounted to the substrate.
The past decade has illustrated that the use of optical „„ „
fiber as an information transport medium allows for BRIEF DESCRIPTION OF THE DRAWING
rugged, high speed, noise immune, low power data 25 FIG. 1 shows a prior art optical fiber interconnection
communication over long distances. Even though coax- to a multichip module mounted on a printed circuit
ial cable and fiber are comparable in cost per foot, opti- board;
cal fiber has not been accepted for short to medium haul FIG. 2 shows one embodiment of an optical fiber
applications due to the high cost of the connections on interconnection to a multichip module in accordance
the fiber ends. The high connector cost is due to two 30 with the present invention;
separate connector requirements. First, since electrical FIG. 3 shows an optical fiber ribbon cable connection
connections are required at both ends of a datalink, the to a multichip module in accordance with another as
fiber ends must be precisely aligned to the optical signal Pect of the present invention;
emitter and detector. Second, although there are experi- FIG- 4 shows the details of the connection arrangements being performed to develop Gallium Arsenide 35 ment °f FIG. 3;
(GaAs) on Silicon (Si) and fluorescent Si, emitters are FIG- 5 shows a toP down view of a substrate having
currently made from discrete III-V materials (either op^/*er„h?les; „ ., , .
LEDs or lasers). Since the signal drivers and receiving FIGS; ^ show d^s of vanous °PtIcal flber lnter"
amphfiers, which are inevitably required in such ar- An ^^PTM t0 °Ptoe^ctro"c ciaTM f . A
rangements, need to be made from Si circuitry, there is 40 ^ ° • 9 Jows 311 °Ptlcal fiber connector for a printed
a need that dissimilar semiconductor devices be com- „T„ ,n' . ,
, . , . - , . , T, ■ FIG. 10 shows an optical fiber ribbon cable connec
bmed m a single connector package. Thus, there is a • * J - i_ J
. . 6, ^ . \, ,&, , . . . tor for msertion m a pnnted circuit board; and
contmumg need to improve the technology for inter- mQS ^ ^ m %^ ^ ... of m ti.
connectmg optical fibers to optoelectromc components. 45 ^ fibef edge colmector ^ its connection to ^he
SUMMARY OF THE INVENTION contacts of a printed circuit board.
The present invention provides an improved optical DETAILED DESCRIPTION
fiber to optoelectromc component connection appara- ^ drawings of the various figures ^ not necessar.
tus which enables an optical fiber to be mounted 5Q fly tQ sca]e and CQntain dimensional relationships (e.g.(
through a hole in a first surface of a substrate such that angles) which ^ exaggerated to aid in the clarity of the
optical signals are coupled onto a flip-chip type opto- description.
electronic component which is mounted on a second shown ^ FIG x is a prior ^ ... for intersurface of the substrate. More particularly, the appara- connecting an optical fiber 101 with a multichip module tus includes a first surface of a substrate having a plural- 55 12q that is mounted on a printed circuit (PC) board 100. ity of electrical paths and contact pads (e.g., solder optical fiber 101 connects to optoelectronic circuit bumps) thereon for mounting a flip-chip type optoelec- no that is wired to printed circuit board 100. The optotronic component, said substrate including a hole electronic circuit 110 connects via various wire paths, formed between a second surface and the first surface of for example 102, to multichip module 120. the substrate, the hole being used to accept an optical 60 The optoelectronic circuit 110 includes plate 111 that fiber. The optoelectronic component includes a plural- has a hole for mounting optical fiber 101 that is then ity of contact pads for mounting to matching contact epoxied to plate 111. The optoelectronic chip 112 is pads on said plurality of electrical paths on said sub- glued or epoxied to bracket 113. The bracket 113 is then strate. The optoelectronic component is aligned over aligned with plate 111 so as to optimize optical signal the hole to couple optical signals to and from the optical 65 coupling between optical fiber 101 and optoelectronic fiber that is mounted through the hole in the substrate. chip 112. When optical signal transfer between the optiAnother apparatus enables an N optical fiber ribbon cal fiber 101 and optoelectronic chip 112 has been opticable to be mounted through N holes in the substrate to mized bracket 113 is spot-welded to plate 111. The leads