A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a thermal conductor on the chip, forming an encapsulant that covers the chip and the thermal conductor, grinding the encapsulant without grinding the thermal conductor or the...http://www.google.com/patents/US7494843?utm_source=gb-gplus-sharePatent US7494843 - Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
Method of making a semiconductor chip assembly with thermal conductor and ...
