Integrated circuit defect review and classification process

REVIEW DICE FOR PRESELECTED TYPES AND RANGE
SIZES OF SURFACE DEFECTS AT PRESELECTED
LOCATIONS OF DICE IN WAFER FORM USING
SCANNING ELECTRON MICROSCOPE

V

I

18

10

CLASSIFY SURFACE DEFECTS INTO PRESELECTED
TYPES AND SIZE RANGES FOUND ON DICE
WHILE IN WAFER FORM

V

I

20

SUMMARIZE RESULTS OF REVIEW OF DICE FOR PRESELECTED TYPES AND SIZE RANGES OF SURFACE DEFECTS INCLUDING PHOTOGRAPHING SUCH SURFACE DEFECTS AT PRESELECTED LOCATIONS OF DICE IN WAFER FORM

Fig. 5A

SCANNING ELECTRON MICROSCOPE
DEFECT REVIEW SHEET
SUMMARY

TESTS:
KLA#:
DATE:

TIME IN/OUT:
KLA OPERATOR ID: _____
SEM PICTURE REQUIRED □ YES □ NO
SURFACE DEFECT RANGE (MICRONS)

PART TYPE:
LOT NUMBER
WAFER ID:
STEP:

SLOT:

DEFECT CNT:
REVIEW OPERATOR ID: