A hybrid (composite) integrated circuit element comprises a substrate, a thin film type integrated circuit formed on a substrate through a thin film process, and a lamination type passive circuit element such as a capacitor, inductor, resitance and a combination thereof formed on the integrated circuit....http://www.google.com/patents/US5643804?utm_source=gb-gplus-sharePatent US5643804 - Method of manufacturing a hybrid integrated circuit component having a laminated body
Method of manufacturing a hybrid integrated circuit component having a ...
