extends downwardly beyond the base 24 of the frame. DEVICE FOR CONNECTING LEADLESS A mounting hole 26 extends from surface 14 through
INTEGRATED CIRCUIT PACKAGE TO A PRINTED the tubular portion.
CIRCUIT BOARD A bracket 28 is shown above the frame 10. This
CROSS REFERENCE TO RELATED APPLICATION 5 bracket sTM *6 IC Packaf ^JTMTM ^ ^
is secured to the frame via holes 30 which are in align
This application is a continuation-in-part application ment with holes 26 in each corner 21.
of Ser. No. 445,045, filed Feb. 22, 1974, and now U.S. FIG. 2 shows the detail of both a cavity 12 and one
Pat. No. 3877064, issued Apr 8, 1975. embodiment of a contact, hereinafter referred to as the
BACKGROUND OF THE INVENTION S-shaped contact 32.
The: contact 32 has a nose 34 on which is a dimple With the development of integrated circuits the prob- which provides contact point 36. The contact tip 38 is lem of connecting these circuits to circuits such as turned downward to prevent accidental catching of and found on a printed circuit board without soldering, damage to the nose and contact point, while yet establishing effective electrical contact be- 15 The eontact 32 is bent into two curves, one opposite tween the circuits on the board and the integrated t0 the other t0 provide the S shape in the main part of circuits have been attacked by many inventors. A num- the contact. This S curve permits large deflective capaber of patents have issued covering means for assem- biHt with reasonabie ioad and streSs levels, bhng a small integrated circuit to a testing apparatus At the lower end of the s curve is a flattened portion and also to a printed circuit board without soldering 20 4Q on which is a di le which provides the second but these means are not considered to be effective contact fat 42 This int en the d (not solutions of the problem. The greater problem of effec- shown) on the inted circuit board 44< lively engaging a large scale integrated circuit package A tail 46 extends beyond and is diSpiaced from the to a printed circuit boarcwithout soldering appearsto second contact int 42 In additionFto hoiding the present such very considerable additional difficult.es 25 contact 32 in th/cavit 12 the tail mits test pr^bi
Ae art 6 ... S W ... When the IC Package *Sin Pjace in frame 10.
A ',. . ., . r The outside wall 48 of cavity 12 contains a tail retain
Accordingly the present invention provides a frame stud so A rjb g2 c n ^ ^
having a plurality of cavities along each side which .. , ■ - i c n. * * J i
• * , Tl i J cfu 'i • TM limit downward travel of the contact and also cooperreceive a contact. The lower end of the contact engages ii} ■■ ■ . . . ■ ■, ■ ;\ . ■ , . 4.. r • * J •■ -*u J TM J * ates in retaining the contact m the cavity. A portion of a circuit on the printed circuit board. The upper end of . .. . f, , ^ , \, v ■ ^ the contact engages the pad on the substrate of the ^ide surface 16 also helps to captivate the contact as integrated circuit package^ On each of the four corners dofthe Portlon °f "PPer surface 14' designated by the of the frame, support clips are provided which permit rererence numeral Sb. ^ the alignment of the integrated circuit package prior to 35 As shown in FIG, 2, contact 32 is retained within
electrical engagement with the upper end of the cav,ty 12 bv *f enf £n§ sur[acesf of the S cur^e- the
contacts contact nose 34, tan 46 and the aforementioned parts
of the cavity. No other securing means are required in
BRIEF DESCRIPTION OF THE DRAWINGS this novel frame.
FIG. 1 is a view of the square frame which contains a 40 FIG- 3 is FIG. 2 but with a IC package 60 shown in
plurality of contact-containing cavities and which re- Place W1*ln the frame- The package consists of a sub
ceives and supports the leadless integrated circuit strate 62 on which are deposited or otherwise fixed
package; pads, whose location is indicated by reference numeral
FIG. 2 shows a cavity in the frame of FIG. 1 and one 64> integrated circuit chips 66 and conductors (not
embodiment of a contact contained therein; 45 shown), which Lead from the pads to the chips. Above
FIG. 3 shows the view of FIG. 2 with a portion of the tne substrate 60 is a heat sink 68 and below is a cover
leadless integrated circuit package positioned in the 70 which protects the chips.
frame- With the IC package 60 in place, the upper contact
FIG. 4 is a cross-section view of a corner of the frame P°int 36 abuts against pad 64 on the substrate. The
of FIG. 1 showing the alignment and support clip; 50 contact configuration; i.e., the S curve, provides wiping
FIG. 5 shows the corner of the frame of FIG. 4 with action between the pad and the contact point as the IC
the leadless integrated circuit package in place; and package is being placed into the frame. Obviously the
FIG. 6 shows a cavity in the frame of FIG. 1 and wiping action improves the electrical contact between
another embodiment of a contact contained therein. the two. Further, as the IC package is being placed in
55 position the contact 32 will rock about lower contact
DESCRIPTION OF THE PREFERRED p0mt 42. This rocking action results in a small amount
EMBODIMENT . , of wiping action which enhances the electrical contact
The frame 10 in FIG. 1 is molded from an insulating between lower contact point 42 and the pad (not
material such as nylon and contains 60 cavities 12 per shown) on printed circuit board 44.
side. Each cavity opens onto the upper surface 14, onto 60 FIG. 3 also shows bracket 28 in place which, as noted
the inside surface 16 and onto the base 17 of the frame. above, secures the IC package 60 to the frame.
The inside surface is built inwardly to provide a ledge FIG. 4 shows the details of mounting holes 26 and
18. As is apparent, only a few of the 240 cavities 12 are support clip 20.
shown on the frame. The leadless IC package (not A metal internally threaded insert 72 is positioned in shown) is received in the center opening 19 of the 65 each hole 26 to receive threaded bolts 74 which enframe and is supported by alignment and support clips gages the insert from the bottom of printed circuit 20 found in each corner of the frame. Molded on the board 44. An oversize washer 76 spans tubular portion bottom of each corner 21 is a tubular portion 22 which 22 of the frame and engages the board.