A device integration method and integrated device. The method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one...http://www.google.com/patents/US7037755?utm_source=gb-gplus-sharePatent US7037755 - Three dimensional device integration method and integrated device
Three dimensional device integration method and integrated device
