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A multiple current path device, for carrying electric current to and conducting heat from an electronic circuit, comprising an optional heat sink, a plurality of conducting substrates forming several electrically insulated current conductors, a thermally conductive, electrically insulating first layer, bonding each conducting substrate and the heat sink, and a plurality of electronic or electric components bonded to the substrates.

Inventors: Derek C. Schuurman, Robert G. Lankin, Richard J. Hellinga
Original Assignee: Agile Systems Inc.
Primary Examiner: Bao Q. Vu
Current U.S. Classification: 363/141; 174/70.00C; 361/637
International Classification: H02M 768; H05K 720

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Citations

Cited PatentFiling dateIssue dateOriginal AssigneeTitle
US4369485Mar 27, 1980Jan 18, 1983Ferranti LimitedCircuit assemblies each with a component cooperating with a connector and clamp to a substrate
US4446188Dec 20, 1979May 1, 1984The Mica CorporationMulti-layered circuit board
US4866571Aug 23, 1984Sep 12, 1989Olin CorporationSemiconductor package
US5038132Dec 22, 1989Aug 6, 1991Texas Instruments IncorporatedDual function circuit board, a resistor element therefor, and a circuit embodying the element
US5223676Nov 19, 1990Jun 29, 1993The Furukawa Electric Co., Ltd.Composite circuit board having means to suppress heat diffusion and manufacturing method of the same
US5837556Jan 6, 1997Nov 17, 1998Sundstrand CorporationMethod of removing a component from a substrate
US6028878Dec 15, 1997Feb 22, 2000Opto Power CorporationLaser diode array with built-in current and voltage surge protection

Referenced by

Citing PatentFiling dateIssue dateOriginal AssigneeTitle
US6356043Mar 22, 2001Mar 12, 2002Motor controller power switch arrangement
US6441509May 16, 2000Aug 27, 2002Sevcon LimitedController for battery-operated vehicle
US6587346Jan 31, 2002Jul 1, 2003Visteon Global Technologies, Inc.Combination electrical power distribution and heat dissipating device
US6794576Jun 4, 2002Sep 21, 2004Cisco Technology, Inc.Power entry apparatus and method
US6885553Jun 5, 2003Apr 26, 2005Rockwell Automation Technologies, Inc.Bus bar assembly for use with a compact power conversion assembly
US7405448Oct 3, 2006Jul 29, 2008Mitsubishi Electric CorporationSemiconductor device having a resistance for equalizing the current distribution

Claims

1. A multiple current path device for carrying electric current to and conducting heat from an electronic circuit, the device comprising:

a plurality of electrically and thermally conducting substrates forming several current conductors that are electrically insulated from each other, and
a plurality of electronic or electric components electrically and thermally connected to said conducting substrates.

2. A device according to claim 1, wherein said device further comprises a heat sink and a thermally conductive, electrically insulating first layer, bonding each said conducting substrate and said heat sink.

3. A device according to claim 1, wherein said device further comprises a plurality of printed circuits arranged on any of the conducting substrates, each printed circuit being electrically insulated from said conducting substrate.

4. A device according to claim 3, wherein said device further comprises a plurality of thermally conductive, electrically insulating second layers bonding said conducting substrate and said individual printed circuits.

5. A device according to claim 3, wherein said conducting substrates have electrically conductive vias, which conduct electricity between said conducting substrates and said printed circuits.

6. A device according to claim 1, wherein each of said electronic or electric components are fastened on one individual conducting substrate.

7. A device according to claim 1, wherein said electronic or electric components are fastened to bridge two or more conducting substrates.

8. A device according to claim 3, wherein said electronic or electric components are fastened on one individual printed circuit.

9. A device according to claim 3, wherein said electronic or electric components are fastened to bridge two or more printed circuits.

10. A device according to claim 3, wherein said electronic or electric components are fastened to bridge one printed circuit and one conducting substrate..

11. A device according to claim 1, wherein said conducting substrates are substantially flat and rectangular.

12. A device according to claim 1, wherein said device comprises two conducting substrates.

13. A device according to claim 1, wherein said device comprises three conducting substrates.

14. A device according to claim 1, wherein said device comprises four conducting substrates.

15. A device according to claim 1, wherein said device comprises five conducting substrates.

16. A device according to claim 1, wherein each of said conducting substrates has a power connection, for connecting to a current carrier.

17. A device according to claim 16, wherein said power connection is a bolt means.

18. A device according to claim 16, wherein said power connection is a protrusion of the conducting substrate itself.

19. A device according to claim 1, wherein said device is a half bridge electric power circuit.

20. A device according to claim 1, wherein said device is a full bridge electric power circuit.

21. A device according to claim 1, wherein said device is a 3-phase bridge electric power circuit.

22. A device according to claim 1, wherein said device further comprises a substantially thermally insulating fibre-glass reinforced resin board, bonded to said thermally conductive, electrically insulating first layer with the use of an adhesive layer and electrically connected to said plurality of electrically and thermally conducting substrates via one or more of said electronic components, said resin board having one or more layers of printed circuits patterns electrically connected to said electric components.

Drawings