Material Characterization/Failure Analysis Engineer, Raxium
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Minimum qualifications:
- Bachelor degree in Materials Science, Electrical Engineering, Physics, or a related field or equivalent practical experience.
- 2 years of experience, operating and interpreting data from Focused Ion Beam/Scanning Electron Microscope (FIB/SEM) and STEM to drive root cause analysis.
- 2 years of experience in a research setting or industry with meticulously examining microscopic features and creating comprehensive reports.
Preferred qualifications:
- Master's or PhD degree in in Materials Science, Electrical Engineering, Physics, or a related field.
- 3 years of industry experience in material characterization/failure analysis of semiconductor materials in optoelectronic applications.
- Experience working with image processing fundamentals and computer vision techniques utilizing software packages, such as Python, MATLAB, JMP, etc.
- Experience working with optoelectronic characterization including EL, FL, CL, EBIC, etc, and material characterization techniques, such as EDS, XPS, SIMS, Nano SIMS, APT.
- Knowledge of epitaxial growth, crystal structures, crystal defects, and surface chemistry.
- Knowledge of semiconductor materials and their properties.
About the job
As a Material Characterization/Failure Analysis Engineer, you will stand at the intersection of process development, yield enhancement, and reliability, serving as a critical resource for driving continuous improvement and problem solving within micro-LED manufacturing. Your primary responsibility will be to meticulously analyze and characterize materials/defects that impact device performance. You'll achieve this by using various range of advanced material characterization techniques and sophisticated tools to delve into the intricate details of material microstructure and surface properties. Through failure analysis, you will identify defect patterns and trends, carefully organizing and managing microscopic images to facilitate correlative and root-cause studies. You will collaborate closely with process development, process integration, yield, and reliability teams, providing actionable insights and recommendations for process improvements.Additionally, you will contribute to the development and improvement of failure analysis protocols, staying current with the latest advancements in analytical techniques. Ultimately, your role will be to unravel the mysteries of device failures, providing the essential information needed to enhance product quality, yield, and reliability.Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.
Responsibilities
- Leverage expertise in material structure, function, and advanced microscopy, conduct investigations to uncover root causes of display defectivity. Leading studies into material properties and process parameters to understand their influence on Light Emitting Diode (LED) performance.
- Evaluate data through analytical techniques, including: Scanning Electron Microscopy (SEM), Scanning Transmission Electron Microscopy (STEM), Energy-Dispersive X-ray Spectroscopy (EDS), X-ray Photoelectron Spectroscopy (XPS), Secondary Ion Mass Spectrometry (SIMS) and Atomic Force Microscopy (AFM) to build a comprehensive understanding of material and defect characteristics and their impact on display performance.
- Correlate findings from electrical, optical, and material characterization techniques to detect defects and deduce their formation mechanisms.
- Document and summarize technical findings, translating them into clear, concise insights.
- Drive the development of novel and advanced microscopy/failure analysis techniques in partnership with cross-functional teams, ensuring continuous enhancement of analytical capabilities.
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