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IEEE EMBS Dallas Chapter Seminar: Apr 13 2012

Advanced Microelectronic Packaging Manufacturing Technologies for Handheld and Implantable Medical Devices

Susan V. Bagen, Endicott Interconnect Technologies, Inc.

As electronics technology advances toward increased functionality with decreasing degrees of size, weight and power (SWaP), medical applications, particularly handheld and implantable, drive unique requirements that differ significantly from commercial & military applications. In addition, the requirements among medical applications can range significantly depending on the end use. Form, fit, function, integrated sensors, batteries, leads, biocompatibility, operational life and reliability specifications define requirements for atypical form factors, unique assemblies and non-standard material sets. Manufacturability and producibility are paramount to the practical implementation of these diverse microelectronic packaging forms. In this presentation, manufacturing methods and materials for producing advanced organic substrates and flex along with ultra fine pitch assemblies for handheld, implantable and in vivo medical devices are discussed.

When
Fri Apr 13, 2012 12pm – 1pm Central Time
Where
ECSS 2.412, University of Texas at Dallas, 800 W Campbell Rd, Richardson, TX (map)