6146:TYO
Disco Corp
¥60,290.00
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-0.25%(-150.00) 1D
Oct 2, 3:30:00 PM GMT+9 · JPY
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|---|
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Open
¥60,000
High
¥61,100
Low
¥59,630
Mkt. cap
6.54T
Avg. vol.
1.41M
Volume
1.58M
Dividend
0.84%
Quarterly dividend
¥126
Ex-dividend date
Sep 29, 2026
P/E ratio
44.93
52-wk high
¥91,680
52-wk low
¥42,370
EPS
¥1,342
Shares outstanding
35.93M
No. of employees
6K
Open
¥60,000
High
¥61,100
Low
¥59,630
Mkt. cap
6.54T
Avg. vol.
1.41M
Volume
1.58M
Dividend
0.84%
Quarterly dividend
¥126
Ex-dividend date
Sep 29, 2026
P/E ratio
44.93
52-wk high
¥91,680
52-wk low
¥42,370
EPS
¥1,342
Shares outstanding
35.93M
No. of employees
6K
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Profile
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
About Disco Corp