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Disco Corp
Previous close
¥68,570.00
Day range
¥67,520.00 - ¥70,770.00
Year range
¥22,640.00 - ¥70,770.00
Market cap
7.37T JPY
Avg Volume
2.54M
P/E ratio
58.49
Dividend yield
0.62%
Primary exchange
TYO
In the news
Financials
Income Statement
Revenue
Net income
| (JPY) | Dec 2025info | Y/Y change |
|---|---|---|
Revenue | 109.29B | 16.82% |
Operating expense | 30.97B | 12.66% |
Net income | 36.73B | 15.46% |
Net profit margin | 33.60 | -1.18% |
Earnings per share | — | — |
EBITDA | 47.34B | 13.01% |
Effective tax rate | 21.50% | — |
Balance Sheet
Total assets
Total liabilities
| (JPY) | Dec 2025info | Y/Y change |
|---|---|---|
Cash and short-term investments | 246.14B | -6.58% |
Total assets | 678.26B | 7.87% |
Total liabilities | 135.65B | -22.35% |
Total equity | 542.61B | — |
Shares outstanding | 108.43M | — |
Price to book | 13.71 | — |
Return on assets | 17.71% | — |
Return on capital | 22.21% | — |
Cash Flow
Net change in cash
| (JPY) | Dec 2025info | Y/Y change |
|---|---|---|
Net income | 36.73B | 15.46% |
Cash from operations | — | — |
Cash from investing | — | — |
Cash from financing | — | — |
Net change in cash | — | — |
Free cash flow | — | — |
About
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Founded
May 5, 1937
Website
Employees
5,256
