Disco Corp (D65) Stock Price & News

DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia

About Disco Corp

CEOKazuma Sekiya

Employees5.55K

FoundedMay 5, 1937

Headquarters-

SectorSemiconductor

Websitedisco.co.jp

All values in JPY	Sep 2025	Dec 2025	Mar 2026	Jun 2026
Revenue	104.62B	109.29B	133.06B	114.31B
Cost of goods sold	31.87B	31.23B	38.66B	32.76B
Cost of revenue	31.87B	31.23B	38.66B	32.76B
Research and development expenses	-	-	34.16B	-
Total research and development expenses	-	-	-	-
Selling, general, and admin expenses	28.36B	30.72B	831.00M	32.51B
Operating expense	28.60B	30.97B	35.87B	32.75B
Total operating expenses	60.48B	62.19B	74.53B	65.52B
Operating income	44.15B	47.10B	58.53B	48.79B
Other non operating income	211.00M	338.00M	449.00M	171.00M
EBT including unusual items	44.92B	46.80B	58.44B	48.41B
EBT excluding unusual items	45.47B	46.98B	58.49B	48.44B
Income tax expense	12.73B	10.06B	15.54B	14.13B
Effective tax rate	28.33%	21.50%	26.59%	29.18%
Other operating expenses	-	-	-	-
Net income	32.15B	36.73B	42.88B	34.22B
Net profit margin	30.73%	33.60%	32.23%	29.94%
Earnings per share	-	-	-	-
Interest and investment income	37.00M	9.00M	226.00M	345.00M
Interest expense	-	-	-	-
Net interest expenses	37.00M	9.00M	226.00M	345.00M
Depreciation and amortization charges	244.00M	244.00M	244.00M	243.00M
EBITDA	47.64B	47.34B	62.24B	52.50B
Gain or loss from assets sale	-	-	-	-

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