一种微影制作方法 A micro film production method

[0001] [0001]

技术领域 FIELD

[0002] 本发明属于太阳能电池技术领域，尤其涉及一种微影制作方法。 [0002] The present invention belongs to the field of solar cell technology, particularly to a lithography manufacturing method.

[0003] _ [0003] _

背景技术 BACKGROUND

[0004] 微影工艺(lithography process)在如今的微电子工业中扮演着十分重要的角色，其主要包括贴膜、曝光(exposure)与显影(development)等步骤。 [0004] lithography process (lithography process) plays a very important role in today's microelectronics industry, which includes film, exposure (exposure) and development (development) and other steps.

[0005] 其中，贴膜过程是通过贴膜机把干膜贴到处理好的芯模上，为接下来的图形转移做准备。 [0005] where, film by film machine process is attached to the handle of the dry film good mandrel, for the next pattern transfer preparation. 贴膜操作好能使干膜很好的粘附在芯模上，避免产生变形与气泡。 Good film adhesion operation makes a good dry film on the core mold, to avoid distortion and bubbles. 曝光则是得到优良的干膜抗蚀图像非常重要的一个制作过程。 Exposure is excellent in the dry film resist obtained image is very important to a production process. 当曝光不足时，由于单体聚合的不彻底，在显影过程中，胶膜溶涨变软，线条不清晰，色泽暗淡，甚至脱胶，在电镀前处理或电镀过程中，膜起翘、渗镀、甚至脱落。 When the exposure is insufficient, because the monomers are not completely in the development process, the film swelling soften lines are not clear, dark color, even unglued before plating or electroplating process, the film warped, diffusion coating or even fall off. 当曝光过头时，会造成难于显影，胶膜发脆、留下残胶等弊病。 When the exposure too far, it will cause difficulty developing, film brittle hair, leaving adhesive residue and other ills. 更为严重的是不正确的曝光将产生图像线宽的偏差，因此曝光掌握好对于生产出高品质产品是相当重要的。 Even more serious is not the correct exposure will produce an image width deviation, and therefore have a good exposure for the production of high-quality products is very important. 显影操作一般在显影机中进行，控制好显影液的温度，传送速度，喷淋压力等显影参数，能够得到好的显影效果。 Developing operation is generally carried out in a developing machine, the developing solution to control the temperature, transmission speed, spray pressure development parameters, it is possible to obtain good developing results. 显影点太高，未聚合的抗蚀膜得不到充分的清洁显影，抗蚀剂的残余可能留在板面上。 Developing point is too high, the unpolymerized resist film not sufficiently clean development, residual resist may remain on the plate. 如果显影点抓得太低，已聚合的干膜由于与显影液过长时间的接触，可能被浸蚀而变得发毛，失去光泽，因此需要对显影点做一个很好的管控。 If the developer point grasp too low, dry film polymerized been in contact for a long time due to the developer may be etched become scared and dull, so the need for developing a good point to make control.

[0006] 基于以上的分析，贴膜、曝光与显影就需要有一个很好的工艺范围。 [0006] Based on the above analysis, film, exposure and development you need to have a good range of technology. 而对于不同的干膜所包含的化学组分与化学特性也是不同的，因此在贴膜、曝光与显影过程中的工艺参数也是不同的，所以需要提供一种技术方案，已解决该等问题。 As for the chemical composition and chemical characteristics of different dry film contained also different, so the film, exposure and development process parameters are different, so it is necessary to provide a solution, is to resolve such problems.

[0007] [0007]

发明内容 SUMMARY

[0008] 为解决上述问题，本发明的目的在于提供一种微影制作方法，贴膜、曝光、显影以最优组合搭配参数来提高产品质量，确定不同种类干膜对应的曝光量以及显影参数来达到最佳广品质量。 [0008] To solve the above problems, an object of the invention to provide a lithography manufacturing method, film, exposed and developed in combination with the optimal parameters to improve product quality, to determine the dry film corresponding to the different types of exposure and development parameters best wide product quality.

[0009] 为实现上述目的，本发明的技术方案为: [0009] To achieve the above object, the present invention is:

一种微影制作方法，包括如下步骤: A micro film production method, comprising the steps of:

510:选择芯模,选定一种材料及合适厚度的芯模，以解决产品表面应力、质量及芯模寿命的问题； 510: Select the mandrel, the selected material thickness and suitable mandrel, the surface of the product to address the problems of stress, and the quality of life of the mandrel;

511:确定不同种类干膜对应的曝光量，对于不同厚度干膜的曝光量，通过采用41节曝光尺的曝光实验来确定； 511: determine the different types of exposure amount corresponding to a dry film, the dry film thickness for the different exposure amount, exposure by the use of 41 feet of exposure determined empirically;

512:确定显影参数。 512: determine development parameters.

[0010] 进一步地，所述步骤SlO中，选择不锈钢304材质的钢板作为电铸芯模。 [0010] Further, the step SlO, select 304 stainless steel as electroforming mandrel. [0011] 进一步地，所述芯膜的厚度为0.3mm或者1.8mm。 [0011] Further, the thickness of the core film is 0.3mm or 1.8mm.

[0012] 进一步地，对于IOOum及以下的干膜使用0.3mm厚度的芯模，曝光量50Mr500MJ之间；而对于100unTl30um的干膜使用1.8mm芯模，曝光量500Mri000MJ之间。 [0012] Further, for IOOum between 0.3mm and below, dry film thickness using the core mold, exposure 50Mr500MJ; and between the dry film used for 100unTl30um 1.8mm mandrel, exposure 500Mri000MJ.

[0013] 进一步地，所述步骤S12包括有:计算显影点，首先确定显影段的长度L，使贴膜的板以速度V1匀速前进，当板的前端到达显影段末尾时停止显影喷淋，让板传送出显影机，等板面水溃干净测量显净部分长度I，通过公式(Ll)/L*100%来计算显影点。 [0013] Further, the step S12 comprises: calculating a developing point, first determine the length of the developing section L, so that the foil plate uniform forward speed V1, when the front end plate of the end stop reaches the developing section of the developing spray, so that board transfer the developing machine, such as the collapse of clean water board measuring net significant part of the length I, by the formula (Ll) / L * 100% to calculate the developer points.

[0014] 本发明微影制作方法以合适厚度的芯模来解决产品表面应力、质量及芯模寿命的问题。 [0014] The lithography manufacturing method in the present invention is suitable thickness mandrel to solve product surface stress, the quality of life of the mandrel and problems. 确定不同种类干膜对应的曝光量以及显影参数来达到最佳产品质量。 Determine the different types of dry film corresponding amount of exposure and development parameters to achieve the best quality of products. 提高显影质量，提高了芯模表面质量以及使用次数，贴膜、曝光、显影以最优组合搭配参数提高产品质量。 Improve the quality of development, improve the mandrel surface quality and frequency of use, film, exposed and developed with the optimal combination of parameters to improve product quality.

[0015] [0015]

附图说明 Brief Description

[0016] 图1是本发明微影制作方法的流程图示。 [0016] FIG. 1 is a flow diagram lithography manufacturing method of the present invention.

[0017] [0017]

具体实施方式 DETAILED DESCRIPTION

[0018] 为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。 [0018] In order to make the objects, technical solutions and advantages of the present invention will be more clearly understood, the accompanying drawings and the following embodiments, the present invention will be described in further detail. 应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。 It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0019] 请参照图1所示，本发明微影制作方法包括如下步骤: [0019] Referring to Figure 1, the lithography manufacturing method of the present invention comprises the steps of:

SlO:选择芯模 SlO: Select mandrel

选定一种材料及合适厚度的芯模，以解决产品表面应力、质量及芯模寿命的问题。 A suitable thickness of the selected material and the mandrel, the surface of the product to address the problems of stress, and the quality of life of the mandrel. 本发明实施例中，选择不锈钢304材质的钢板作为电铸芯模，不锈钢304材质的钢板表面及硬度都较其他材质的芯模好；其中，优选两种厚度:0.3mm、l.8mm。 Embodiment of the invention, the choice of stainless steel 304 as electroforming mandrel 304 stainless steel surface and hardness than other materials mandrel good; which, preferably in two thicknesses: 0.3mm, l.8mm.

[0020] Sll:确定不同种类干膜对应的曝光量 [0020] Sll: determine the different types of the exposure amount corresponding to a dry film

对于不同厚度干膜的曝光量，通过采用41节曝光尺的曝光实验来确定。 For dry film thickness of different exposure levels, as determined by using 41-foot exposure exposure experiments. 本发明实施例中，IOOum及以下的干膜使用0.3mm厚度的芯模，曝光量50Mr500MJ之间，显影点控制在85%〜90%之间，实用于电铸mask类产品。 Embodiment of the present invention, IOOum and below using a dry film thickness of 0.3mm mandrel, between the exposure amount 50Mr500MJ, the developing control point between 85% ~ 90%, practical in electroforming mask products. 而100unTl30um的干膜使用1.8mm芯模，曝光量500Mri000MJ之间，显影点控制在899^93%之间，实用于普通PCB电铸产品。 The dry film 100unTl30um use 1.8mm mandrel between the exposure 500Mri000MJ, developing point of control between 899 ^ 93%, practical cast products in general PCB electricity.

[0021] S12:确定显影参数 [0021] S12: determine development parameters

计算显影点，首先确定显影段的长度L，然后用速度V1使贴膜的板匀速前进，当板的前端到达显影段末尾时停止显影喷淋，让板传送出显影机，等板面水溃干净测量显净部分长度I。 Computing the developing point, first determine the length of the developing section L, and then with the speed V1 so that the foil plate uniform forward, stop the development of the front end of the shower when the plate reaches the end of the development station, so that the transfer plate developing machine, and so on board clean water collapse significant part of the length measuring net I. 套用公式(Ll)/L*100%来计算显影点。 Apply the formula (Ll) / L * 100% to calculate the developer points. 如果没有达到预期的显影点，可以通过修改速度来调整显影点，具体公式为:V:= If you do not achieve the desired development point can be adjusted by changing the speed of development point, the specific formula is: V: =

(V1*预期的显影点)/本次的显影点。 (V1 * expected development point) / developing this point.

[0022] 应用时，采用控制变量法分别对芯模、干膜、曝光能量、显影点进行定性的分析。 [0022] When applied, using control variables respectively mandrel method, dry film, exposure energy, developing qualitative analysis point. 其中，针对芯模，主要包括有如下分析步骤: 使用前检查板面的状况(包括平整度、光亮度、硬度、是否有划痕)，对不同型号的芯模进行标号分等级；将不同型号的芯模表面情况等级一样的取用做相同次数的生产； Among them, for the core module, including the following analytical steps: pre-use check the status of the board (including flatness, brightness, hardness, scratches), to carry out different types of mandrel label grading; the different models The mandrel surface conditions make the same level of access to the same number of production;

观察、记录使用n次后芯模表面的状况以及做出产品的质量； Observe and record the use of the n-th surface condition after the mandrel and make the quality of the product;

根据记录数据对芯模进行评定优、中、差，并对于评定优的生产进行选用。 According to data recorded on the mandrel assessed superior, middle, and poor, and for the assessment of production were excellent choice.

[0023] 而对于干膜、曝光能量、显影点，针对不同的干膜曝光能量与显影点不尽相同。 [0023] For the dry film, exposure energy, development point, the dry film for different exposure energies and the developing point vary. 以一种干膜A为例进行介绍，主要包括如下步骤: A Case Study in a dry film introduced, including the following steps:

选用各种类型的开口图形进行曝光，曝光能量XmrYmj采用24节曝光尺进行确定； Selection of the various types of opening pattern is exposed, using an exposure energy XmrYmj 24 tablet was determined;

固定曝光能量为Wmj (Xmj<ffmj<Ymj),做显影点实验，范围50%〜95% ;根据作出的板开口情况确定显影点范围85%〜93%。 Fixed exposure energy Wmj (Xmj <ffmj <Ymj), do the developing point experiments, the range of 50 ~ 95%; 85% point range determined that the developing ~93% based on plate opening circumstances.

[0024] 另外，还需进行组合试验以及定量分析。 [0024] In addition, the need to carry out a combination of experimental and quantitative analysis. 组合试验为:将曝光参数XmrYmj，显影参数859^93%进行组合实验，选出最优组合。 Combination trials are: the exposure parameters XmrYmj, developing parameters 859 ^ 93% combined experiments, select the optimal combination. 确定最优组合:优等级芯模，Zmj曝光能量，859^93%显影点；而定量分析主要是按照定性参数优等级芯模，Zmj曝光能量，85%〜93%显影点，做n轮实验验证效果，根据开口表现的具体情况进行改进，得出最后参数。 To determine the optimal combination: excellent rating mandrel, Zmj exposure energy, 859 ^ 93% of the developing point; and quantitative analysis mainly on the basis of qualitative parameters superior grade mandrel, Zmj exposure energy, 85% ~93% of the developing point, do n wheel experiment verify the effect, according to the specific circumstances of the opening performance improvements, resulting in a final argument.

[0025] 以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。 [0025] The above description is only preferred embodiments of the present invention, it is not intended to limit the present invention, any modification within the spirit and principles of the present invention made, equivalent replacement and improvement, should be included in the present within the scope of the invention.