具体实施方式 detailed description

[0048] 现将详细参考本示范性实施例,在附图中说明所述示范性实施例的实例。 [0048] will now be detailed with reference to the present exemplary embodiment, illustrating an example of the exemplary embodiment in the drawings. 另外,凡可能之处，在图式及实施方式中使用相同标号的元件/构件代表相同或类似部分。 In addition, where possible, the same reference numerals in the drawings and embodiments of elements / components the same or similar parts.

[0049] 图1是本发明的一实施例所示出的立体打印系统的方块图。 [0049] FIG. 1 is a perspective view of the invention of the printing system illustrated a block diagram an embodiment. 请参照图1，立体打印系统10包括立体打印装置100以及电子装置200。 Please refer to FIG. 1, the printing system 10 includes a three-dimensional stereoscopic printing apparatus 100 and the electronic device 200. 立体打印装置100耦接电子装置200，并包括处理器110。 Three-dimensional printing apparatus 100 is coupled to the electronic device 200, and includes a processor 110. 相似的。 similar. 电子装置200包括处理器210。 The electronic device 200 includes a processor 210.

[0050] 电子装置200为具有运算功能的装置，例如是笔记本电脑、平板电脑或台式电脑等计算机装置，本发明并不对电子装置200的种类加以限制。 [0050] The electronic device 200 is a device having arithmetic function, such as a laptop, tablet or desktop computers and other computer devices, the present invention is not to limit the types of electronic device 200. 在本实施例中，电子装置200的处理器210可编辑与处理一立体物体的立体模型并传送相关的立体模型信息至立体打印装置100，使立体打印装置100可依据立体模型信息打印出立体的物件。 In this embodiment, the processor 210 of the electronic device 200 can be editing and processing a three-dimensional model of three-dimensional objects and transmit information relating to the three-dimensional model of three-dimensional printing apparatus 100, so that three-dimensional printing device 100 can print out the three-dimensional three-dimensional model based on the information object. 具体来说，立体模型可为一数字立体图像文件，其例如由电子装置200通过电脑辅助设计(computer-aided design,简称CAD)或动画建模软件等构建而成。 Specifically, the three-dimensional model for a digital stereo image files, which, for example by the electronic device 200 is built by computer-aided design (computer-aided design, referred to as CAD) or animation modeling software.

[0051] 立体打印装置100适于依据电子装置200所传送的立体模型信息而打印出一立体物体。 [0051] 100 perspective view of the printing apparatus is adapted to transmit information on the basis of three-dimensional model of the electronic device 200 and prints out a three-dimensional object. 详细来说，处理器110依据立体模型信息控制立体打印装置100的各个部件，以将成型材料反复打印在平台上直到生成整个立体物体。 In detail, based on three-dimensional model information processor 110 controls the respective components of the three-dimensional printing apparatus 100, the molding material is repeated to print on the entire internet until a three-dimensional object.

[0052] 处理器110与处理器210例如是中央处理器(Central Processing Unit,简称CPU)，或是其他可程序化的一般用途或特殊用途的微处理器(MiCToprocessor)、数字信号处理器(Digital Signal Processor,简称DSP)、可编程控制器、专用集成电路(Applicat1n Specific Integrated Circuits,简称ASIC)、可编程逻辑器件(Programmable Logic Device,简称PLD)或其他类似装置或这些装置的组合,本发明对此不限制。 [0052] processor 110 and processor 210, for example, a central processor (Central Processing Unit, referred to as the CPU), or other programmable general purpose or special-purpose microprocessor (MiCToprocessor), digital signal processors (Digital Signal Processor, called DSP), or a combination of these means or other similar devices, programmable controllers, application specific integrated circuits (Applicat1n Specific Integrated Circuits, abbreviated ASIC), programmable logic devices (Programmable Logic Device, referred PLD), the present invention is This does not limit.

[0053] 需说明的是，立体模型将经过进一步的编译与计算而产生立体打印装置100可读取与据以执行打印功能的立体模型信息。 [0053] It should be noted that the three-dimensional model has been further compiled and calculated to produce three-dimensional printing device 100 can be read and, according to the three-dimensional model to perform the print function information. 详细来说，电子装置200的处理器210首先对立体模型进行一切层处理而产生立体模型的多个切层物件。 In detail, the processor 210 of the first electronic device 200 for all three-dimensional model layer processing to generate a plurality of cut layers objects stereo model. 一般来说，处理器210用固定间隔的切层平面切割立体模型，以便提取这些切层物件的截面轮廓。 Generally, a processor 210 with the cut plane of the layer at regular intervals cut three-dimensional model, in order to extract the profile of these cut layers objects. 切割立体模型的切割间隔可视为切层物件的厚度。 Cut three-dimensional model can be regarded as a cutting interval thickness shear layer objects. 切层物件的厚度越小，立体物体的成型精密度越高，但成型时间也越长。 Thickness shear layer object, the higher the precision molding three-dimensional objects, but the molding time is longer.

[0054] 另外，处理器210还依据各个切层物件的截面轮廓产生对应的控制代码。 [0054] In addition, the processor 210 also generates a corresponding control code based on cross-sectional profile of each cut layer objects. 于此，控制代码即为立体打印装置100可读取与据以执行打印功能的立体模型信息。 Here, the control code is a perspective view of the printing apparatus 100 can be read according to the three-dimensional model to perform the print function information. 换句话说，立体打印装置100的处理器110依据控制代码来控制立体打印装置100中的构件，从而将各个切层物件逐层的成型于平台上。 In other words, the processor 110 on the basis of three-dimensional printing device 100 control codes to control the three-dimensional printing apparatus 100 members, which will cut each layer of the object layer by layer forming on the platform. 在一实施例中，控制代码例如是G代码(G code)。 In one embodiment, for example, the control code is a G code (G code).

[0055] 图2是本发明一实施例所示出的立体打印方法的流程图。 [0055] FIG. 2 is a flowchart illustrating a printing method illustrated in perspective view an embodiment of the present invention. 本实施例的方法适用于图1的立体打印系统10，以下即结合立体打印系统10中的各构件说明本实施例立体打印方法的详细步骤。 The method of the present embodiment is applied to a perspective printing system 10 of Figure 1, i.e. the following combination of three-dimensional printing system 10 of each member is described in detail in Example perspective step printing method of the present embodiment.

[0056] 首先，在步骤S210中，处理器210获取一立体模型的多个切层物件，并产生每一切层物件相对于一切层平面的多个二维图像。 [0056] First, in step S210, the processor 210 acquires a plurality of cutting a three-dimensional model of the object layer, and generates all layers of each object with respect to a plurality of two-dimensional images of all the layer plane. 从这些二维图像可清楚得知各个切层物件的截面轮廓。 From these two-dimensional images that can clearly cut profile of each layer objects. 这些切层物件至少包括相邻的第一切层物件与第二切层物件，换句话说，第一切层物件与第二切层物件可视为这些切层物件中任意两个相邻的切层物件。 These shear layer adjacent objects including at least a first layer of the object and a second cut all layers objects, in other words, the first thing every layer and the second layer object cut cut layers of these items can be considered as any two adjacent cut layer objects.

[0057] 在步骤S230中，当第一切层物件的二维图像与第二切层物件的二维图像之间的比较关系符合叠加条件，处理器210叠加第一切层物件与第二切层物件而产生堆叠物件的厚度叠加信息。 [0057] In step S230, when comparing the relationship between the two-dimensional image of the first object and all layers of two-dimensional image of the second shear layer between object meets the superposition condition, processor 210 is superimposed first and second cut all layers objects the thickness of the layer of the object to produce a stack object overlay information. 也就是说，处理器210可通过各种图像比对方式对第一切层物件的二维图像与第二切层物件的二维图像进行比对。 That is, the processor 210 may compare the way the first two-dimensional image on a two-dimensional image of all layers of objects and the second cut-layer objects to compare a variety of images. 倘若第一切层物件的二维图像与第二切层物件的二维图像之间的比较关系符合叠加条件，第一切层物件与第二切层物件将被叠加而构成堆叠物件。 If the relationship between the two-dimensional image compare all layer objects first and second two-dimensional images of objects between layers cut in line superimposed condition, the first thing every layer and the second layer cut articles will be added to constitute a stack objects. 此外，处理器110例如可依据第一切层物件与第二切层物件的厚度信息与控制代码而产生堆叠物件的厚度叠加信息。 In addition, the processor 110 for example, according to the first object and the second cut all layers objects layer thickness information and control code to generate a thickness of a stack object overlay information.

[0058] 之后，在步骤S250中，处理器210可依据厚度叠加信息启始打印机制，以打印关联于立体模型的立体物体。 After the [0058] In step S250, the processor 210 may overlay information based on the thickness of the starting print mechanism to print three-dimensional objects associated with the three-dimensional model. 详细来说，处理器210可将堆叠物件的厚度叠加信息传送至立体打印装置100，致使立体打印装置100依据厚度叠加信息打印出关联于立体模型的立体物体。 In detail, the processor 210 may be the thickness of a stack of objects superimposed information is transmitted to the three-dimensional printing apparatus 100, resulting in three-dimensional printing apparatus 100 according to the thickness of the overlay information associated with print three-dimensional objects in three-dimensional model.

[0059] 需说明的是，在一实施例中，处理器210将依一方向逐层比对各个切层物件，并依据比对结果持续叠加符合叠加条件的多个切层物件而生成至少一堆叠物件。 [0059] It should be noted that, in one embodiment, the processor will drill more than 210 layers of each object according to a tangential direction, and based on the results of ongoing superimposed over a plurality of cut layers superimposed objects meet the conditions to generate at least one Stacking objects. 堆叠物件的厚度将依据叠加的次数而定。 The thickness of the stack will be based on the number of objects may be superimposed. 也就是说，对于一个原本具有多个切层物件的立体模型来说，经上述的依序的比对处理与叠加处理后将转换为具有至少一堆叠物件的立体模型。 That is, for a three-dimensional model of the original object having a plurality of layers is cut by sequential than the process of dealing with the superposition will be converted to three-dimensional models of objects having at least one stack. 因此，立体模型的切层方式可依照本发明的方法而动态的调整，而立体打印装置100可依据这些堆叠物件对应的结合厚度与结合控制代码来打印出立体物体。 Thus, three-dimensional model cut layer manner in accordance with the method of the present invention may be dynamically adjusted, and three-dimensional printing apparatus 100 can be based on the combined thickness of the stacked objects corresponding binding control code to print three-dimensional objects.

[0060] 需说明的是，上述实施例虽然是以电子装置200的处理器210执行步骤S210〜S250为例。 [0060] It should be noted that, although the above embodiment is an electronic device 200 processor 210 steps S210~S250 example. 但在另一实施例中，执行步骤S210〜S250的可以是立体打印装置100的处理器110。 However, in another embodiment, may perform the steps S210~S250 is a perspective view of the print device processor 110 100. 进一步来说，处理器110可从电子装置200获取多个切层物件的相关信息，并产生每一切层物件相对于一切层平面的多个二维图像。 Further, processor 110 may obtain a plurality of cut layers of objects related information from the electronic device 200, and generates all layers of each object with respect to a plurality of two-dimensional images of all the layer plane. 相似地，当处理器110产生堆叠物件的厚度叠加信息后，处理器110可据以控制立体打印装置100的其他打印构件执行立体打印功能。 Similarly, when the processor 110 generates a stack thickness of overlay information items, the processor 110 may control other print member according to the printing apparatus 100 to perform three-dimensional stereoscopic printing function.

[0061] 于此，为了要清楚说明本发明的立体打印方法的运作原理，以下将以光固化立体成型(SLA)为例进行说明。 [0061] here, in order to clearly illustrate the operating principle of three-dimensional printing process of the present invention, the following will be light curing stereolithography (SLA) as an example. 图3是本发明一实施例所示出的立体打印装置的局部示意图。 Figure 3 is a partial schematic perspective view showing the printing apparatus according to an embodiment of the present invention shown. 请参照图3，立体打印装置100包括处理器110、盛槽120、移动平台130以及光源140。 Referring to Figure 3, three-dimensional printing apparatus 100 includes a processor 110, the groove 120 filled, mobile platform 130 and a light source 140. 在此同时提供直角坐标系以便于描述相关构件及其运动状态。 This provides both in a Cartesian coordinate system in order to describe the relevant components and their state of motion. 盛槽120用以盛装液态成型材102，且移动平台130的局部浸于液态成型材102中。 Sheng tank 120 for containing liquid into sections 102, 130 and the mobile local platform immersed in a liquid into a 102 profiles. 光源140用以提供光照至液态成型材102。 140 light source for providing light to the liquid into a 102 profiles.

[0062] 处理器110电性连接光源140与移动平台130，以使移动平台130的局部在盛槽120上方沿Z轴移动。 [0062] Processor 110 is electrically connected to the light source 140 and the mobile platform 130, so that the moving platform 130 at the top of the partially filled tanks 120 along the Z axis. 由于本实施例的液态成型材102采用光敏树脂或其他适用的光固化材料，故液态成型材102在受到光源140的照射之后固化。 Since the liquid into the profile 102 of the present embodiment is the use of a photosensitive resin, or other suitable light-curable material, a molding 102 so that the liquid is irradiated with a light source 140 after curing.

[0063] 值得一提的是，在一实施例中，叠加条件的设置例如是判断第二切层物件的二维图像的涵盖范围是否大于或等于第一切层物件的二维图像的涵盖范围。 [0063] It is worth mentioning that, in one embodiment, for example, is superimposed on the conditions set determines the second cut-layer coverage of two-dimensional images of objects is greater than or equal to the coverage of all two-dimensional image of the first layer article . 也就是说，当第二切层物件的二维图像的涵盖范围大于或等于第一切层物件的二维图像的涵盖范围时，经叠加第一切层物件与第二切层物件可产生堆叠物件的至少一结合厚度与至少一结合控制代码。 That is, when the coverage of the two-dimensional image of the second cut-layer objects greater than or equal coverage of all two-dimensional image of the first layer of the object when the object layer by superimposing the first and second cut all layers objects can produce a stack combined thickness of at least one object with at least one combination of control code. 以下将针对不同的叠加条件与叠加方式列举实施例以详细说明本发明。 The following conditions will be different superimposed superimposed manner to examples to illustrate the present invention.

[0064] 图4是本发明一实施例所示出的立体打印方法的流程图。 [0064] FIG. 4 is a flow diagram illustrated stereoscopic printing method according to an embodiment of the present invention. 本实施例的方法适用于图1的立体打印系统以及图3的立体打印装置，以下即结合立体打印系统10与立体打印装置100中的各构件说明本实施例立体打印方法的详细步骤。 The method of the present embodiment is applicable to the printing system of Figure 1 a perspective view and a perspective view of the printing apparatus of FIG. 3, i.e. the following combination of the printing system 10 and the three-dimensional perspective of each member the printing apparatus 100 is described in detail in Example perspective step printing method of the present embodiment.

[0065] 首先，处理器210对立体模型进行切层处理而获取M个切层物件(步骤S401)，而M为大于I的整数。 [0065] First, the processor 210 cut three-dimensional model layer processing acquired the M cut layer object (step S401), and M is an integer greater than I. 接着，处理器210产生分别对应至这些切层物件的多个初始控制代码(步骤S402)。 Subsequently, the processor 210 generates respectively corresponding to a plurality of initial control code for these objects cut layers (step S402). 换言之，处理器210依序产生第i层切层物件的初始控制代码，其中i为大于O且小于等于M的整数。 In other words, the processor 210 sequentially generates the i-th layer control code initial shear layer article, wherein i is greater than O and less than or equal to M an integer.

[0066] 举例来说，当M等于3，代表处理器210将立体模型切成三层切层物件，分别为第I层切层物件、第2层切层物件以及第3层切层物件。 [0066] For example, when M is equal to 3, on behalf of the processor 210 will be cut into three-dimensional model of the object cut layers, respectively, Tier I cut layer objects, Layer 2 cut layer objects and layer 3 cut layer objects. 接着，依据各切层物件的截面轮廓信息，处理器210分别产生第I层切层物件的初始控制代码、第2层切层物件的初始控制代码以及第3层切层物件的初始控制代码。 Then, according to the profile information of each cut layer objects, the processor 210 generate Tier I cut layer objects initial control code, the initial control code initial control code layer 2 and layer objects cut layer 3 cut layer objects.

[0067] 之后，电子装置200将各切层物件的初始控制代码，像是各切层物件的G code代码，输出至立体打印装置100。 After the [0067], the electronic device 200 will each cut layer objects initial control codes, such as the cut layers of G code object code output to the three-dimensional printing apparatus 100. 于是，处理器110依据这些初始控制代码产生每一切层物件的二维图像(步骤S403)。 Thus, the processor 110 generates a two-dimensional image of all layers per object (step S403) in accordance with the initial control codes. 简言之，处理器110依据第i层切层物件的初始控制代码产生第i层切层物件的二维图像。 In short, the processor 110 based on the i-th layer control code initial cut layers produce two-dimensional images of objects the i-layer shear layer objects. 从这些二维图像可清楚得知各个切层物件的截面轮廓。 From these two-dimensional images that can clearly cut profile of each layer objects.

[0068] 接着，处理器110判断第(i+1)层切层物件的二维图像的涵盖范围是否等于第i层切层物件的二维图像的涵盖范围(步骤S404)。 Coverage [0068] Subsequently, the processor 110 judges whether (i + 1) layer shear layer objects covered by the two-dimensional image is equal to the i-layer shear layer of two-dimensional image of the object (step S404). 换言之，处理器110判断相邻的上下两个切层物件的截面轮廓是否相同。 In other words, the processor 110 determines whether the cross-sectional profile adjacent the upper and lower cut layers of the same object. 若步骤S404判断为是，处理器110累加当前累计的厚度与第(i+1)层切层物件的厚度而产生结合厚度(步骤S405)。 If judged to be in step S404, the processor 110 accumulates current cumulative thickness of the first (i + 1) layer thickness shear layer generated object binding thickness (step S405). 之后，处理器110判断是否存在第(i+2)层切层物件(步骤S406)。 After that, the processor 110 determines whether there is paragraph (i + 2) layer shear layer items (step S406). 若步骤S406判断为是，处理器110继续往下一层切层物件做判断(设定i = i+Ι)(步骤S407)，并再次重复步骤S404。 If judged to be in step S406, the processor 110 continues to cut down one layer objects to make a judgment (set i = i + Ι) (step S407), and repeats step S404 again. 由此可知，相邻且截面轮廓相同的切层物件可堆叠成为一堆叠物件，此堆叠物件的厚度视堆叠累积次数而定。 It can be seen, adjacent and cut the same profile layer objects can be stacked into a stack object, depending on the thickness of the stack of objects stacked cumulative number may be.

[0069] 另一方面，若步骤S404判断为否，代表第(i+Ι)层切层物件的二维图像的涵盖范围不等于第i层切层物件的二维图像的涵盖范围。 Coverage [0069] On the other hand, if the judgment in step S404 is NO, it means that (i + Ι) cut layer object layer coverage is not equal to two-dimensional image of the i-layer shear layer of two-dimensional image of the object. 也就是说，处理器110判断相邻的两个切层物件的截面轮廓并不相同。 That is, the processor 110 determines the cross-sectional profile of two adjacent layers cut is not the same thing. 于是，处理器110依据堆叠物件的结合厚度调整光源的输出强度(步骤S408)。 Thus, the processor 110 based on the thickness of the stacked combination of object light output intensity adjustment (step S408). 在本实施例中，堆叠物件的结合厚度越厚，光源的输出强度也需调整至更高的输出强度，以固化具有结合厚度的堆叠物件。 In the present embodiment, the thickness of the stacked combination of thicker objects, the output intensity of the light source can be adjusted to a higher output intensity, to cure the stacked article with binding thickness.

[0070] 接着，处理器110设定结合控制代码(步骤S409)。 [0070] Next, the processor 110 sets binding control code (step S409). 可以知道的是，由于第(i+1)切层物件与第i切层物件的截面轮廓相同，因此第(i+Ι)切层物件的初始控制代码与第i切层物件的初始控制代码相同，而当前堆叠物件的结合控制代码也与第i切层物件的初始控制代码相同。 Can know it is that, since the (i + 1) cut the same profile and the first thing i cut layer layer objects, so the initial control code initial control code section (i + Ι) cut layer and the first thing i cut layer objects same, while the current stack object code is a combination of control and the first thing i cut layer initial control codes. 基此，处理器110可设定结合控制代码为第(i+Ι)切层物件的初始控制代码。 Based on this, the processor 110 can be set to combine the control code for the first (i + Ι) cut layer objects initial control code.

[0071] 在获取堆叠物件的结合厚度与结合控制代码后，处理器110可依据结合控制代码控制光源的照射路径，以固化被照射的液态成型材102，而在移动平台130上形成立体物体(步骤S410)。 [0071] After obtaining a stack of objects in conjunction with a combined thickness control code, processor 110 may control the light source based on the control code in conjunction illumination path, to cure the liquid to be irradiated sections 102, 130 on a mobile platform and form three-dimensional objects ( step S410). 换言之，处理器110依据结合厚度将移动平台130移动至Z轴上的一位置时，光源140便会依据调整后的输出强度以及堆叠物件的结合控制代码照射部分液态成型材102而使之固化。 In other words, the processor 110 based on the combined thickness of the mobile platform 130 moves to a position in the Z-axis, the combination of the light source 140 will be adjusted based on the output intensity of the control code and stack objects illuminated portion of the liquid into a 102 profiles that make them cured. 因此，移动平台130沿Z轴移动，其所经位置的液态成型材102便能逐层地被固化，最终形成完整的立体物体50。 Accordingly, the mobile platform 130 along the Z-axis, its position by a molding liquid layer by layer 102 will be able to be cured, eventually forming a complete three-dimensional object 50.

[0072] 举例来说，图5A与图5B是本发明一实施例所示出的立体物体的剖面示意图。 [0072] For example, Figures 5A and 5B is an embodiment of the invention shown in cross-sectional schematic view of a three-dimensional object. 请同时参照图5A与图5B，在本范例实施例中，立体物体因切层处理而具有多个切层物件5a〜5g，其中各切层物件5a〜5g具有相同的标准厚度。 Please see also Figure 5A and 5B, the embodiment, the three-dimensional object due to shear layer processing layer having a plurality of cut articles 5a~5g In this example embodiment, in which each object 5a~5g cut layer thickness with the same standard. 如图5A所示，假设切层物件5b〜5d的二维图像的覆盖范围相同，而切层物件5e〜5f的二维图像的覆盖范围相同。 5A, the same coverage assumptions object 5b~5d cut layer two-dimensional image of the figure, while the coverage of the same two-dimensional image of the object 5e~5f of cut layers. 因此，经叠加切层物件5b、切层物件5c以及切层物件5d可获取堆叠物件51，且堆叠物件51的结合厚度为标准厚度的三倍。 Therefore, the object layer stack Gache 5b, 5c cut layer objects and layer objects cut 5d 51 items available stacking and stack objects three times the thickness of the combined thickness of the standard 51. 其中，堆叠物件51的结合控制代码与切层物件5b、切层物件5c以及切层物件5d的初始控制代码相同。 Which, combined with the stacked article 51 of the control code and cut layer article 5b, the same control codes initial cut layer object layer objects 5c and 5d is cut.

[0073] 相似的，经叠加切层物件5e以及切层物件5f可获取堆叠物件5J，且堆叠物件5J的厚度为标准厚度的两倍。 [0073] Similarly, by Gache layer stack objects 5e and 5f cut layer objects available stack object 5J, and the stack is twice the thickness of the object 5J standard thickness. 其中，堆叠物件5J的结合控制代码与切层物件5e以及切层物件5f的初始控制代码相同。 Which, combined with a stack object 5J control code and cut the same shear layer objects and layer objects 5e 5f initial control code. 此外，堆叠物件5H等同于切层物件5a，而堆叠物件5K等同于切层物件5g。 In addition, the stack object 5H equivalent cut layer object 5a, and stack objects 5K cut layer object is equivalent to 5g.

[0074] 基此，假设打印方向为从切层物件5a打印至切层物件5g的方向。 [0074] Based on this, it is assumed the print orientation layer objects from cut to cut layers 5a Print article 5g direction. 当立体打印装置100打印完切层物件5a(堆叠物件5H)后，立体打印装置100仅需增强光源140的输出强度，并依据堆叠物件51的结合厚度移动一次移动平台130就可通过一次的扫描产生堆叠物件51。 When the three-dimensional printing device 100 cut layer printed article 5a (stack object 5H), the three-dimensional printing apparatus 100 only enhance the output intensity of the light source 140, and the combined thickness of the moving object on the basis of a stack 51 of a mobile platform 130 can scan through a produce a stack object 51. 相较之下，倘若未经由叠加生成堆叠物件51，立体打印装置100则需移动三次移动平台130，并且进行三次的扫描来依序生成切层物件5b〜5d。 In contrast, if not generated by the superposition of 51 stacked objects, three-dimensional printing apparatus 100 need to move three mobile platform 130, and three times the scan to sequentially generate shear layer object 5b~5d. 由此可知，基于堆叠物件51的生成，立体打印装置100可有效的加快打印速率。 It can be seen, generated 51 based stack objects, three-dimensional printing device 100 can effectively accelerate print speed.

[0075] 图6是本发明一实施例所示出的立体打印方法的流程图。 [0075] FIG. 6 is a flowchart showing the three-dimensional printing method illustrated an embodiment of the present invention. 本实施例的方法适用于图1的立体打印系统以及图3的立体打印装置，以下即结合立体打印系统10与立体打印装置100中的各构件说明本实施例立体打印方法的详细步骤。 The method of the present embodiment is applicable to the printing system of Figure 1 a perspective view and a perspective view of the printing apparatus of FIG. 3, i.e. the following combination of the printing system 10 and the three-dimensional perspective of each member the printing apparatus 100 is described in detail in Example perspective step printing method of the present embodiment.

[0076] 首先，处理器210产生一立体模型，此立体模型可以是使用者利用模型编辑软件所制作的模型，也可以是通过三维扫描技术扫描物体所取得的立体模型，本发明对于立体模型的建立方式与取得方式并不限制。 [0076] First, the processor 210 generates a three-dimensional model, this three-dimensional model can be user-editing software using the model produced by the model, can also be three-dimensional model of three-dimensional scanning technology to scan the object made, the present invention is useful for three-dimensional model establish ways of acquiring mode is not limited. 处理器210对立体模型进行切层处理而获取M个切层物件(步骤S601)，而M为大于I的整数。 Processor 210 cut three-dimensional model layer processing acquired the M cut layer object (step S601), and M is an integer greater than I. 接着，处理器210产生分别对应至这些切层物件的多个初始控制代码(步骤S602)。 Subsequently, the processor 210 generates respectively corresponding to a plurality of initial control code for these objects cut layers (step S602). 换言之，处理器210依序产生第i层切层物件的初始控制代码，其中i为大于O且小于等于M的整数。 In other words, the processor 210 sequentially generates the i-th layer control code initial shear layer article, wherein i is greater than O and less than or equal to M an integer. 于是，处理器210依据这些初始控制代码产生每一切层物件的二维图像(步骤S603)。 Thus, the processor 210 generates a two-dimensional image of all layers per object (step S603) in accordance with the initial control codes. 上述步骤S601〜S603与前述实施例的步骤S401〜S403相似，于此不再赘述。 Step above steps S601~S603 aforementioned embodiments S401~S403 similar, not repeat them here.

[0077] 与前述实施例不同的是，处理器210判断第(i+Ι)层切层物件的二维图像的涵盖范围是否大于或等于第i层切层物件的二维图像的涵盖范围(步骤S604)。 [0077] different from the previous embodiment, the processor determines the scope of section 210 (i + Ι) layer cut layer two-dimensional image of the object is greater than or equal to the i-layer coverage of the two-dimensional image of the object cut layer ( step S604). 具体来说，处理器210判断下一层切层物件的截面轮廓是否完全覆盖住上一层切层物件的截面轮廓。 Specifically, the processor 210 determines the next one cut layer object profile is completely covered with a layer of cut profile live layer objects. 若步骤S604判断为是，处理器210累加当前累计的厚度与第(i+Ι)层切层物件的厚度而产生结合厚度(步骤S605)。 If the step S604 is determined to be the thickness of shear layer object layer processor 210 accumulates current cumulative thickness of the first (i + Ι) generated combined thickness (step S605). 之后，处理器210判断是否存在第(i+2)层切层物件(步骤S606)。 After that, the processor 210 determines whether there is paragraph (i + 2) layer shear layer items (step S606). 若步骤S606判断为是，处理器210继续往下一层切层物件做判断(设定i = i+Ι)(步骤S607)，并再次重复步骤S604。 If judged to be in step S606, the processor 210 continues to cut down one layer objects to make a judgment (set i = i + Ι) (step S607), and repeats step S604 again. 由此可知，相邻且涵盖范围递增的切层物件可结合为一堆叠物件。 It can be seen, adjacent and increasing coverage cut layer objects can be combined into a stack object. 因此，与前述实施例不同的是，本实施例的堆叠物件具有多个结合厚度，而此堆叠物件的这些结合厚度视堆叠累积次数以及各切层物件的截面轮廓而定。 Therefore, with the foregoing embodiment except that the stacked article of the present embodiment has a plurality of binding a thickness, the thickness depending on the combination of these as well as the cumulative number of stacked layers of objects cut cross-sectional profile of this object may be stacked.

[0078] 另一方面，若步骤S604判断为否，代表第(i+Ι)层切层物件的二维图像的涵盖范围小于第i层切层物件的二维图像的涵盖范围。 [0078] On the other hand, if the judgment in step S604 is NO, it means that (i + Ι) cut layer object layer coverage is less than the two-dimensional image of the i-layer shear layer of two-dimensional image of the object coverage. 也就是说，处理器110判断下一层切层物件的截面涵盖范围小于上一层切层物件的截面涵盖范围。 That is, the next one cut layer processor 110 determines the scope of objects smaller than the cross-sectional layer object layer cut sectional coverage. 于是，处理器210输出堆叠物件的多个结合厚度(S608)。 Thus, a plurality of processor 210 outputs the combined thickness of the stacked articles (S608). 再者，处理器210还计算并输出堆叠物件的结合控制代码(S609)。 Furthermore, the processor 210 also calculates and outputs a combination of stacked objects control code (S609). 具体来说，处理器210通过比对各切层物件的涵盖范围来获取堆叠物件的多个结合控制代码。 Specifically, the processor 210 in combination control code by multiple alignment of the cut layer objects to get coverage of a stack object.

[0079] 举相邻的第I层切层物件与第2层切层物件为例，若第2层切层物件的涵盖范围大于第I层切层物件的涵盖范围，处理器210累加第I层切层物件的厚度与第2层切层物件的厚度而产生第一结合厚度，并记录第2层切层物件的厚度为第二结合厚度。 [0079] For Tier I cut layers adjacent to the object with layer 2 shear layer objects, for example, if the scope of the second layer is greater than the cut layer object layer objects Tier I cut coverage, accumulate processor 210 Part I cut layer thickness of the layer of objects and object thickness shear layer and the second layer to produce a first combined thickness and thickness of the recording layer of the second layer of the object cut is the second joint thickness. 接着，处理器210比对第I层切层物件的涵盖范围与第2层切层物件的涵盖范围，以产生关联于第一结合厚度的第一结合控制代码与关联于第二结合厚度的第二结合控制代码。 Subsequently, the processor 210 Tier I ratio of cut layers and objects covered by the scope of the second layer cut layer object to generate the code associated with the first binding associated with the thickness of the first binding control to the first second binding thickness two combined control code. 也就是说，在本实施例中，单一堆叠物件可能具有多个结合厚度，而这些结合厚度将分别对应至不同的结合控制代码。 That is, in the present embodiment, a single object may have a plurality of binding a stack thickness, which would correspond to the combined thickness of the different binding control code. 换句话说，在单一堆叠物件中，对应于不同的结合控制代码的截面范围具有不同的结合厚度。 In other words, in a single article in the stack, a range of different cross-section corresponding to the control code in combination with different binding thickness.

[0080] 基此，当立体打印装置100的处理器110接收到这些结合厚度与这些结合控制代码后，处理器I1依据这些结合厚度调整光源的输出强度(S610)。 [0080] Based on this, when the three-dimensional printing device processor 110 100 received after these combined thickness of these combined control code processor I1 thickness adjustment based on these combined output light intensity (S610). 处理器110依据这些结合控制代码控制光源的照射路径，以固化被照射的液态成型材102，而在移动平台130上形成立体物体(步骤S611)。 Control processor 110 based on the combination of source code control illumination path, to cure the liquid to be irradiated sections 102, and in the formation of three-dimensional objects moving platform 130 (step S611). 具体来说，处理器110可依据结合厚度中最厚的厚度将移动平台130移动至Z轴上的一位置时，光源140便依据这些不同的结和厚度来调整光源140的输出强度，以及依照当前调整的输出强度与对应的结合控制代码照射部分液态成型材102而使之固化。 Specifically, the processor 110 can be based on the combined thickness of the thickest thickness of the mobile platform 130 is moved to a position in the Z-axis, the light source 140 will be based on these different junctions and to adjust the thickness of the light output intensity 140, and in accordance with the The combination of the current adjustment control code output intensity irradiated portion corresponding to the profile 102 leaving liquid cured.

[0081] 举例来说，图7A与图7B是本发明一实施例所示出的立体物体的剖面示意图。 [0081] For example, Figures 7A and 7B are an embodiment of the invention shown in a cross-sectional schematic view of a three-dimensional object. 图7C是本发明一实施例所示出的获取结合控制代码的示意图。 7C is a schematic diagram of a combined control code to obtain an embodiment of the invention shown.

[0082] 请同时参照图7A与图7B，在本范例实施例中，立体物体因切层处理而具有多个切层物件7a〜7c，其中各切层物件7a〜7c具有相同的标准厚度。 [0082] Please see also Figure 7A and 7B, in this example embodiment, the three-dimensional object due to shear layer processing layer having a plurality of cut articles 7a~7c, wherein each object 7a~7c cut layers have the same standard thickness. 在本实施例中，假设光源140可固化的最大厚度为标准厚度的五倍。 In the present embodiment, the maximum thickness of the light source 140 is assumed as a standard thickness of the curable five times. 也就是说，倘若光源140的输出强度为100%，则可固化的厚度为标准厚度的五倍。 That is, if the output intensity of the light source 140 is 100%, can be cured five times the thickness of the standard thickness. 倘若光源140的输出强度为60%，则可固化的厚度为标准厚度的三倍，依此类推。 If the output intensity of the light source 140 is 60%, it can be cured in a thickness of three times the standard thickness, and so on.

[0083] 如图7A与图7B所示，假设切层物件7a〜7c的截面涵盖范围依序递增。 As shown in [0083] FIG. 7A and 7B, the assumption that objects sectional cut layer coverage 7a~7c sequentially incremented. 因此，经叠加切层物件7a、切层物件7b以及切层物件7c可获取堆叠物件7D。 Therefore, the object layer stack Gache 7a, 7b and the cut-cut layer object layer objects available 7c stacked objects 7D. 在本范例实施例中，由于切层物件7a、切层物件7b以及切层物件7c的涵盖范围各自不同，因此堆叠物件7D具有三种结合厚度。 In this example embodiment, since the cut layer object coverage 7a, 7b and the cut-cut layer object layer 7c of each object is different, so the stack object 7D has three combined thickness. 如图7B所示，堆叠物件7D可区分成部分7D_1、部分7D_2以及部分7D_3。 7B, 7D can stack objects area into sections 7D_1, part 7D_2 and some 7D_3. 部分7D_1的结合厚度为标准厚度的三倍，部分7D_2的结合厚度为标准厚度的二倍，且部分7D_3的结合厚度与标准厚度相同。 Combined thickness of the portion 7D_1 is three times the standard thickness, combined with the thickness of the standard thickness portion 7D_2 twice, and the same combined thickness of the standard thickness portion 7D_3.

[0084] 请再参照图7C，切层物件7a具有相对于切层平面的涵盖范围7a_s，切层物件7b具有相对于切层平面的涵盖范围7b_s，且切层物件7c具有相对于切层平面的涵盖范围7c_S。 [0084] Referring again to FIG. 7C, cut layer article 7a with respect to the layer plane tangential coverage 7a_s, cut layer object layer 7b with respect to the tangential plane coverage 7b_s, and cut layer object layer 7c with respect to the tangential plane coverage 7c_S. 由此可知，切层物件7a、切层物件7b以及切层物件7c三者相互重叠的部分为重叠范围7D_ls。 It can be seen, cut layer objects 7a, 7b and the cut-cut layer object layer objects 7c three overlapping part overlapping ranges 7D_ls. 切层物件7b以及切层物件7c两者相互重叠的部分为重叠范围7D_2s。 Cut layer object 7b and 7c cut layer objects overlapping part of the two overlapping ranges 7D_2s. 切层物件7c未与切层物件7a以及切层物件7b重叠的部分为重叠范围7D_3s。 7c not cut layer objects and layer objects cut 7a and 7b cut layer objects overlap partially overlapping ranges 7D_3s.

[0085] 相对应的，重叠范围7D_ls所对应的结合厚度为标准厚度的三倍。 [0085] Correspondingly, the corresponding overlapping ranges 7D_ls three times the combined thickness of the standard thickness. 重叠范围7D_2s所对应的结合厚度为标准厚度的两倍。 Overlapping ranges 7D_2s combined thickness corresponds to twice the standard thickness. 重叠范围7D_3s所对应的结合厚度与标准厚度相同。 Overlapping ranges 7D_3s combined thickness corresponding with the standard of the same thickness. 也就是说，部分7D_1相对于切层平面的截面范围为涵盖范围7D_ls，部分7D_2相对于切层平面的截面范围为涵盖范围7D_2s，且部分7D_3相对于切层平面的截面范围为涵盖范围7D_3s。 In other words, part 7D_1 range with respect to the plane of the cross-sectional cut layer of coverage 7D_ls, part 7D_2 range with respect to a cross-sectional plane of the layer is cut coverage 7D_2s, and some 7D_3 range with respect to a cross-sectional plane of the layer is cut coverage 7D_3s. 因此，基于涵盖范围7D_ls、涵盖范围7D_2s以及涵盖范围7D_3s，可产生对应至不同结合厚度的结合控制代码。 Therefore, based on the scope 7D_ls, scope and coverage 7D_2s 7D_3s, it can produce a corresponding control code to combine different binding thickness.

[0086] 基此，假设打印方向为从切层物件7a打印至切层物件7c的方向。 [0086] Based on this, it is assumed the print orientation layer from the cut to the direction of print items 7a and 7c cut layer objects. 基于前述说明可知，立体打印装置100仅需移动一次移动平台130就可产生堆叠物件7D。 Based on the foregoing description, only 100 mobile three-dimensional printing device 130 can produce a mobile platform stacked objects 7D. 进一步来说，立体打印装置100依据部分7D_1的结合厚度调整光源140的输出强度至60%，并依据部分7D_1所对应的结合控制代码而在移动平台130上生成堆叠物件7D的部分7D_1。 Further, three-dimensional printing apparatus 100 according to the combined thickness of the portion 7D_1 adjust the intensity of light output 140 to 60%, and in accordance with section 7D_1 control code corresponding to the combination generated on a mobile platform 130 stacked objects 7D part 7D_1. 接着，立体打印装置100依据部分7D_2的结合厚度调整光源140的输出强度至40%，并依据部分7D_2所对应的结合控制代码而在移动平台130上生成堆叠物件7D的部分7D_2。 Then, three-dimensional printing apparatus 100 according to the thickness of the part 7D_2 combined light output intensity adjustments 140 to 40 percent, and in accordance with section 7D_2 control code corresponding to the combination generated on a mobile platform 130 stacked objects 7D part 7D_2. 最后，立体打印装置100依据部分7D_3的结合厚度调整光源140的输出强度至20%，并依据部分7D_3所对应的结合控制代码而在移动平台130上生成堆叠物件7D的部分7D_3。 Finally, the combination of three-dimensional printing apparatus 100 according to the thickness of the part 7D_3 adjusting the output intensity of the light source 140 to 20 percent, and in accordance with section 7D_3 corresponding control code generated by combining objects stacked on a mobile platform 130 7D part 7D_3. 由此可知，基于堆叠物件7D的生成，立体打印装置100可有效的加快打印速率。 It can be seen, based on the stack object 7D generated, three-dimensional printing device 100 can effectively accelerate print speed.

[0087] 综上所述，在本发明的上述实施例中，可通过叠加符合叠加条件的多个切层物件，来产生具有累加厚度的堆叠物件。 [0087] In summary, in the above-described embodiments of the present invention, can be superimposed by superimposing meet the conditions of the shear layer of a plurality of objects, the object to produce a stack having a cumulative thickness. 如此，立体打印装置可依据堆叠物件的累加厚度调整光源的输出强度，并相对应的依据结合后的控制代码来控制照射路径。 Thus, three-dimensional printing device can adjust the output intensity of the light source based on the cumulative thickness of a stack of objects, and the corresponding control codes based upon binding to control the illumination path. 相较于切层厚度一致的立体打印方式，本发明的实施例可依据叠加后的堆叠物件减少移动平台的移动次数以及光源的扫描次数，以大幅提高立体打印装置的打印效率。 Compared to the three-dimensional uniform thickness shear layer print mode, embodiments of the present invention can be based on a stack object superimposed reduce the number of moves and the number of scanning light source mobile platform to dramatically improve printing efficiency stereoscopic printing apparatus.

[0088] 最后应说明的是:以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。 [0088] Finally, it should be noted that: the above embodiments are merely provided for describing the technical solutions of the present invention, but not intended to limit; although reference to the foregoing embodiments of the present invention has been described in detail, one of ordinary skill in the art should understand: it still can be on the technical programs of the preceding embodiments described modify, or part of them or all of the technical features equivalent replacements; and such modifications or replacements do not make the essence of corresponding technical solutions depart from the various embodiments of the present invention, range of technical solutions.