USD760180S1 - Hexcell channel arrangement for use in a boat for a deposition apparatus - Google Patents

Hexcell channel arrangement for use in a boat for a deposition apparatus Download PDF

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Publication number
USD760180S1
USD760180S1 US29/482,760 US201429482760F USD760180S US D760180 S1 USD760180 S1 US D760180S1 US 201429482760 F US201429482760 F US 201429482760F US D760180 S USD760180 S US D760180S
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Prior art keywords
hexcell
boat
deposition apparatus
channel arrangement
view
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US29/482,760
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James Dempster
Jason Maynard
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HZO Inc
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HZO Inc
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Priority to US29/482,760 priority Critical patent/USD760180S1/en
Assigned to HZO, INC. reassignment HZO, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DEMPSTER, JAMES, MAYNARD, JASON
Priority to US14/445,628 priority patent/US20140335271A1/en
Priority to US14/634,034 priority patent/US20150167151A1/en
Assigned to PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) reassignment PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
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Publication of USD760180S1 publication Critical patent/USD760180S1/en
Assigned to HZO, INC. reassignment HZO, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: PACIFIC WESTERN BANK
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO HONG KONG LIMITED, HZO, INC.
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Description

FIG. 1 is a perspective view of a hexcell channel arrangement for use in a boat for a deposition apparatus showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a cross sectional view thereof, taken along line 3-3 of FIG. 2;
FIG. 4 is a cross sectional view thereof, taken along line 4-4 of FIG. 2; and,
FIG. 5 is a bottom view thereof.
The dash-dot-dashed broken lines represent the boundary lines of the claimed design and the even dashed broken lines represent unclaimed subject matter that forms no part of the claimed design. All surfaces not shown form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a hexcell channel arrangement for use in a boat for a deposition apparatus, as shown and described.
US29/482,760 2012-01-10 2014-02-21 Hexcell channel arrangement for use in a boat for a deposition apparatus Active USD760180S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/482,760 USD760180S1 (en) 2014-02-21 2014-02-21 Hexcell channel arrangement for use in a boat for a deposition apparatus
US14/445,628 US20140335271A1 (en) 2012-01-10 2014-07-29 Boats configured to optimize vaporization of precursor materials by material deposition apparatuses
US14/634,034 US20150167151A1 (en) 2012-01-10 2015-02-27 Carrier systems for introducing materials into material processing systems

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/482,760 USD760180S1 (en) 2014-02-21 2014-02-21 Hexcell channel arrangement for use in a boat for a deposition apparatus

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
US13/737,737 Continuation-In-Part US9156055B2 (en) 2012-01-10 2013-01-09 Precursor supplies, material processing systems with which precursor supplies are configured to be used and associated methods
US29/484,069 Continuation-In-Part USD764423S1 (en) 2012-01-10 2014-03-05 Corrugated elements for defining longitudinal channels in a boat for a deposition apparatus

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29/484,069 Continuation-In-Part USD764423S1 (en) 2012-01-10 2014-03-05 Corrugated elements for defining longitudinal channels in a boat for a deposition apparatus
US14/445,628 Continuation-In-Part US20140335271A1 (en) 2012-01-10 2014-07-29 Boats configured to optimize vaporization of precursor materials by material deposition apparatuses

Publications (1)

Publication Number Publication Date
USD760180S1 true USD760180S1 (en) 2016-06-28

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US29/482,760 Active USD760180S1 (en) 2012-01-10 2014-02-21 Hexcell channel arrangement for use in a boat for a deposition apparatus

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD806046S1 (en) * 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) * 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

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USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
US5904958A (en) 1998-03-20 1999-05-18 Rexam Industries Corp. Adjustable nozzle for evaporation or organic monomers
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
US7115984B2 (en) * 2002-06-18 2006-10-03 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
US20100081104A1 (en) 2008-09-29 2010-04-01 Applied Materials, Inc. Evaporator for organic materials and method for evaporating organic materials
US7705430B2 (en) * 2005-04-27 2010-04-27 Disco Corporation Semiconductor wafer and processing method for same
USD637166S1 (en) * 2010-04-09 2011-05-03 Panasonic Electric Works Co., Ltd. Electroluminescence module
US20110111593A1 (en) * 2009-11-09 2011-05-12 Masahiro Kanno Pattern formation method, pattern formation system, and method for manufacturing semiconductor device
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638383S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD643820S1 (en) * 2010-04-09 2011-08-23 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
US8551864B2 (en) * 2011-03-25 2013-10-08 Sumitomo Electric Industries, Ltd. Method of manufacturing semiconductor device
US8558371B2 (en) * 2010-03-23 2013-10-15 Samsung Electronics Co., Ltd. Method for wafer level package and semiconductor device fabricated using the same
USD695242S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus

Patent Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4303694A (en) 1979-05-04 1981-12-01 Daniel Bois Method and device of deposition through vacuum evaporation making use _of a modulated electron beam and a screen
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
US5904958A (en) 1998-03-20 1999-05-18 Rexam Industries Corp. Adjustable nozzle for evaporation or organic monomers
US7115984B2 (en) * 2002-06-18 2006-10-03 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
US7705430B2 (en) * 2005-04-27 2010-04-27 Disco Corporation Semiconductor wafer and processing method for same
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
US20100081104A1 (en) 2008-09-29 2010-04-01 Applied Materials, Inc. Evaporator for organic materials and method for evaporating organic materials
US20110111593A1 (en) * 2009-11-09 2011-05-12 Masahiro Kanno Pattern formation method, pattern formation system, and method for manufacturing semiconductor device
US8558371B2 (en) * 2010-03-23 2013-10-15 Samsung Electronics Co., Ltd. Method for wafer level package and semiconductor device fabricated using the same
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638383S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD643820S1 (en) * 2010-04-09 2011-08-23 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD637166S1 (en) * 2010-04-09 2011-05-03 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD704155S1 (en) * 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
US8551864B2 (en) * 2011-03-25 2013-10-08 Sumitomo Electric Industries, Ltd. Method of manufacturing semiconductor device
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD695242S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD806046S1 (en) * 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) * 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

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