| About 161 results  | www.google.com/patents/WO2010151251A8?cl=en The present invention relates generally to the field of micro-scale or millimeter
scale devices and to the use of multi-layer multi-material ... |
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 | www.google.com/patents/CA2233225A1?cl=en Methods of manipulating data in a thermal stereolithography apparatus,
characterized in that the data represents a plurality of start/stop ... |
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 | www.google.com/patents/WO2004101857A3?cl=en Numerous electrochemical fabrication methods and apparatus are provided for
producing multi-layer structures (e.g. having meso-scale or ... |
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 | www.google.com/patents/WO2004101855A3?cl=en A method of fabricating three-dimensional structures from a plurality of adhered
layers of at least a first and a second material wherein the first ... |
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 | www.google.com/patents/WO2005065433A3?cl=en Some embodiments of the present invention are directed to techniques for
building up single layer or multi-layer structures (222) on dielectric or ... |
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 | www.google.com/patents/WO2003095709A3?cl=en Multilayer structures are electrochemically fabricated from at least one structural
material (e.g. nickel ), that is configured to define a desired ... |
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 | www.google.com/patents/WO2004101856A3?cl=en Embodiments of the present invention provide mesoscale or microscale three-
dimensional structures (e.g. components, device, and the like). |
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 | www.google.com/patents/EP1262305B1?cl=en | Referenced by. Citing Patent, Filing date, Publication date, Applicant, Title ... |
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 | www.google.com/patents/WO2005065431A3?cl=en Embodiments of the present invention are directed to the formation of microprobe
tips elements (164) having a variety of configurations. |
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 | www.google.com/patents/WO2003095711A3?cl=en Multilayer structures are electrochemically fabricated on a temporary (e.g.
conductive) substrate and are thereafter bonded to a permanent (e.g. ... |
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