| About 37 results  | www.google.com/patents/US5960712 A disposable screen used in a screen printing system for printing onto electronic
devices is formed of a non-metallic material. The screen is ... |
|
 | www.google.com/patents/US6194251 An integrated circuit die or chip may be positioned within an integrated circuit
package by providing a spacer connected to the die and ... |
|
 | www.google.com/patents/US5994784 An integrated circuit die or chip may be positioned within an integrated circuit
package by providing a spacer connected to the die and ... |
|
 | www.google.com/patents/US6316952 An integrated circuit die test apparatus adapted to minimize damage to solder
balls in a ball grid array. The apparatus includes a plurality of ... |
|
 | www.google.com/patents/US6200832 The invention is directed to the application of viscous materials, such as the
adhesives used in LOC die attach processes, to a lead frame by ... |
|
 | www.google.com/patents/US6528867 An integrated circuit device comprising a semiconductor connection component
attached to a semiconductor die with an electrically conductive ... |
|
 | www.google.com/patents/US6204093 The invention is directed to the application of viscous materials, such as the
adhesives used in LOC die attach ... |
|
 | www.google.com/patents/US5759875 A packaged LOC die assembly is disclosed including a die dielectrically adhered
to the underside of a lead frame. Reduced-size filler particles ... |
|
 | www.google.com/patents/US6436732 The invention is directed to the application of viscous materials, such as the
adhesives used in LOC die attach processes, to a lead frame by ... |
|
 | www.google.com/patents/US6703260 A leadframe including offsets extending from a major plane thereof. The offsets
extend from the major plane at a non-perpendicular angle ... |
|
| |