| About 789 results  | www.google.com/patents/WO2009035858A3?cl=en Methods for fabricating an imager die package and resulting die packages are
disclosed. An imager die packaging process may include dicing ... |
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 | www.google.com/patents/WO2008005161A3?cl=en The invention includes semiconductor assemblies having two or more dies. An
exemplary assembly has circuitry associated with a first die front ... |
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 | www.google.com/patents/USD394844 FIG. 1 is an enlarged top perspective view of a temporary package for
semiconductor dice showing my new design;. FIG. 2 is a left side elevational view
thereof;. |
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 | www.google.com/patents/US5916004 Fabrication of support structures for use in field emitter displays through a
photolithographic process that involves (1) depositing a photolithable ... |
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 | www.google.com/patents/US6379983 A multi-chip module (MCM) that fails testing after its assembly is repaired by
generating a wire-bonding solution for a repair die during testing, ... |
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 | www.google.com/patents/US6217232 The present invention provides a method and apparatus for mounting an opto-
electronic device on a substrate and aligning it with an optic fiber ... |
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 | www.google.com/patents/US6093933 Logic circuitry formed in street areas between adjacent fabricated electronic
devices may be used as auxiliary or redundant components to ... |
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 | www.google.com/patents/USD402638 FIG. 1 is an enlarged top perspective view of a temporary package for
semiconductor dice showing our new design;. FIG. 2 is a left side elevational
view thereof;. |
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 | www.google.com/patents/US6531345 Logic circuitry formed in street areas between adjacent fabricated electronic
devices may be used as auxiliary or redundant components to ... |
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 | www.google.com/patents/US8129847 An interconnect for mounting an electronic device to a substrate includes a base
layer between the electronic device and the substrate in ... |
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